| Patent Number |
Title Of Patent |
Date Issued |
| 7608484 |
Non-pull back pad package with an additional solder standoff |
October 27, 2009 |
| Disclosed herein is a method of manufacturing a semiconductor package with a solder standoff on lead pads that reach to the edge of the package (non-pullback leads). It includes encapsulating a plurality of die on a lead frame strip. The lead frame strip comprises a plurality of package |
| 7488623 |
Integrated circuit chip packaging assembly |
February 10, 2009 |
| An integrated circuit chip packaging assembly having a first and second package side. An integrated circuit chip has a substrate side and an active circuit side. The chip includes integrated circuit devices formed on the active circuit side. The active circuit side of the chip is on the |
| 7476976 |
Flip chip package with advanced electrical and thermal properties for high current designs |
January 13, 2009 |
| A QFN package and method of making same is provided comprising a substrate having a metal line extending from a connection element on a perimeter region of the substrate to a high current contact pad on interior region of the substrate. A semiconductor chip having an active surface gener |
| 7335536 |
Method for fabricating low resistance, low inductance interconnections in high current semicondu |
February 26, 2008 |
| A method for fabricating a low resistance, low inductance device for high current semiconductor flip-chip products. A structure is produced, which comprises a semiconductor chip with metallization traces, copper lines in contact with the traces, and copper bumps located in an orderly and |
| 7256482 |
Integrated circuit chip packaging assembly |
August 14, 2007 |
| An integrated circuit chip packaging assembly having a first and second package side. An integrated circuit chip has a substrate side and an active circuit side. The chip includes integrated circuit devices formed on the active circuit side. The active circuit side of the chip is on the |
| 7084494 |
Semiconductor package having integrated metal parts for thermal enhancement |
August 1, 2006 |
| A semiconductor device comprising a metallic leadframe (103) with a first surface (103a) and a second surface (103b). The leadframe includes a chip pad (104) and a plurality of segments (107); the chip pad is held by a plurality of straps (105), wherein each strap has a groove (106). A c |
| 7026710 |
Molded package for micromechanical devices and method of fabrication |
April 11, 2006 |
| According to the present invention, a plastic land-grid array package, a plastic ball-grid package, and a plastic leaded package for micromechanical components are fabricated by a molding process characterized by placing a sheet-like protector on the surface of the components during |
| 6916689 |
Plastic chip-scale package having integrated passive components |
July 12, 2005 |
| A semiconductor device has passive components integrated with the circuit and encapsulated in a plastic package for solder ball or leaded attachment. A plastic chip-scale semiconductor device has a substrate made of a plurality of patterned insulating layers alternating with patterned |
| 6858910 |
Method of fabricating a molded package for micromechanical devices |
February 22, 2005 |
| A plastic land-grid array package, a ball-grid array package, and a plastic leaded package for micromechanical components are fabricated by a molding process characterized by lining the cavity surfaces of the top and bottom mold halves with a protective plastic film, which also protects |
| 6753616 |
Flip chip semiconductor device in a molded chip scale package |
June 22, 2004 |
| A robust, low inductance electronic package for small area semiconductor chips is provided which includes a flexible polymer film having electronic circuitry on one or more major surfaces, a bumped flip chip integrated circuit attached to the first surface, an array of solder balls to th |
| 6696757 |
Contact structure for reliable metallic interconnection |
February 24, 2004 |
| A metallurgical interconnection for electronic devices is described, wherein the interconnection has first and second interconnection metals. The first metal is shaped to enlarge the contact area, thus providing maximum mechanical interconnection strength, and to stop nascent cracks, |
| 6586676 |
Plastic chip-scale package having integrated passive components |
July 1, 2003 |
| A semiconductor device has passive components integrated with the circuit and encapsulated in a plastic package for solder ball or leaded attachment. A plastic chip-scale semiconductor device has a substrate made of a plurality of patterned insulating layers alternating with patterned |
| 6541832 |
Plastic package for micromechanical devices |
April 1, 2003 |
| Low-cost plastic cavity-up land-grid array packages and ball-grid array packages are provided, suitable for wire-bonded chips having micromechanical components. The packages feature a thermal heat spreader and a protective lid. The package structure disclosed is flexible with regard |
| 6518089 |
Flip chip semiconductor device in a molded chip scale package (CSP) and method of assembly |
February 11, 2003 |
| A robust, low inductance electronic package for small area semiconductor chips is provided which includes a flexible polymer film having electronic circuitry on one or more major surfaces, a bumped flip chip integrated circuit attached to the first surface, an array of solder balls to th |
| 6489178 |
Method of fabricating a molded package for micromechanical devices |
December 3, 2002 |
| A plastic land-grid array package, a ball-grid array package, and a plastic leaded package for micromechanical components are fabricated by a molding process characterized by lining the cavity surfaces of the top and bottom mold halves with a protective plastic film, which also protects |
