| Patent Number |
Title Of Patent |
Date Issued |
| 6197222 |
Lead free conductive composites for electrical interconnections |
March 6, 2001 |
| An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the met |
| 5866044 |
Lead free conductive composites for electrical interconnections |
February 2, 1999 |
| An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the met |
| 5545429 |
Fabrication of double side fully metallized plated thru-holes, in polymer structures, without se |
August 13, 1996 |
| The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a patterned polymer structure to sai |
| 5392177 |
Sealed DASD having humidity control and method of making same |
February 21, 1995 |
| A sealed direct access storage device wherein a head is positioned for interaction with a storage medium in which the relative humidity is controlled by placing a predetermined amount of desiccant and a predetermined amount of water in the sealed volume of the device. At any given st |
| 5337475 |
Process for producing ceramic circuit structures having conductive vias |
August 16, 1994 |
| Improved vie-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multi-layer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass sphe |
| 5283104 |
Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates |
February 1, 1994 |
| Improved via-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multilayer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spher |
