Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Cook; Lance B.
Address:
Austin, TX
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
5897375 Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit ma April 27, 1999
A method for chemical mechanical polishing (CMP) a copper layer (22) begins by forming the copper layer (22). The copper layer (22) is then exposed to a slurry (24). The slurry (24) contains an oxidizing agent such as H.sub.2 O.sub.2, a carboxylate salt such as ammonium citrate, an abras










 
 
  Recently Added Patents
Push to release cover for a portable electronic device
Data security for dynamic random access memory using body bias to clear data at power-up
Plants and seeds of hybrid corn variety CH450823
Light powered hearing aid
Bi-level switching with power packs
Systems, methods, and media for firewall control via remote system information
O-space imaging: highly efficient parallel imaging using complementary nonlinear encoding gradient fields and receive coil geometries
  Randomly Featured Patents
Self-stimulation signal detection in an optical transmission system
Syndiotactic 1,2-polybutadiene synthesis
Electrical outlet type extension cord reel with auxiliary outlet
Absorb decode algorithm for 10gbase-t LDPC decoder
Controlling power distribution among multiple wires in communication cable
Micromachined devices with apertures
Folding cart
Method of connecting beams and columns of steel frame construction
Oxygen carrier
Hard resinous polyols