Resources Contact Us Home
Cook; Lance B.
Austin, TX
No. of patents:

Patent Number Title Of Patent Date Issued
5897375 Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit ma April 27, 1999
A method for chemical mechanical polishing (CMP) a copper layer (22) begins by forming the copper layer (22). The copper layer (22) is then exposed to a slurry (24). The slurry (24) contains an oxidizing agent such as H.sub.2 O.sub.2, a carboxylate salt such as ammonium citrate, an abras

  Recently Added Patents
Apparatus and method for performing lawful intercept in group calls
LED light source lamp having drive circuit arranged in outer periphery of LED light source
Server-side connection resource pooling
Image forming apparatus and warming up method thereof
Message transfer apparatus, output method, and computer program product
DL control channel structure enhancement
Automated security analysis for federated relationship
  Randomly Featured Patents
Polymer emulsion agent for cross-linking a polymer emulsion and method for making a polymer film
Orthopedic table
Apparatus, system, and method for storing and retrieving compressed data
Table leg
Methods for depleting hydrogen sulfide in natural gas from the exploitation of crude oil/natural gas mixtures
Roll fuser apparatus and release agent metering system therefor
Type font
Multifunctional acrylate based abrasion resistant coating composition
Method and apparatus for evaluating integrated circuit design performance using basic block vectors, cycles per instruction (CPI) information and microarchitecture dependent information
Layout method of a semiconductor memory device