Resources Contact Us Home Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE     Inventor: Cook; Lance B. Address: Austin, TX No. of patents: 1 Patents: Patent Number Title Of Patent Date Issued 5897375 Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit ma April 27, 1999 A method for chemical mechanical polishing (CMP) a copper layer (22) begins by forming the copper layer (22). The copper layer (22) is then exposed to a slurry (24). The slurry (24) contains an oxidizing agent such as H.sub.2 O.sub.2, a carboxylate salt such as ammonium citrate, an abras       Recently Added Patents Microfluidic radial fiber laser utilizing an external polarizer to modulate its azimuthal intensity distribution Circle cutting jig Sheet connector having a terminal protruding from a conductive pattern on a substrate to engage a terminal of another connector Sending routing protocol data on a multi-access network segment Cathode active material for lithium secondary battery Systems and methods for dual process data decoding Seismic data acquisition and processing quality control   Randomly Featured Patents Method of measuring impurities Simulated baseball game Multiprocessor system with interactive synchronization of local clocks Power management in digital receivers that adjusts at least one a of clock rate and a bit width based on received signal Free list and ring data structure management Indirect arithmetic control Cordless inflator Process for the preparation of 2-(2',4'-dihydroxyphenyl)-4,6-diaryl-s-triazines Checkstand counter with dual accumulation zones Method of continuous hot rolling and apparatus for welding steel bars thereof © 2006-2011. PatentGenius.com All Rights Reserved.