Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Cook; Lance B.
Address:
Austin, TX
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
5897375 Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit ma April 27, 1999
A method for chemical mechanical polishing (CMP) a copper layer (22) begins by forming the copper layer (22). The copper layer (22) is then exposed to a slurry (24). The slurry (24) contains an oxidizing agent such as H.sub.2 O.sub.2, a carboxylate salt such as ammonium citrate, an abras










 
 
  Recently Added Patents
3D image display device and driving method thereof
Printer driver, storage medium, and information processing apparatus
High-level program interface for graphics operations
Management control of household appliances using RFID communication
Recombinant Treponema spp. proteins for use in vaccine, antibodies against said proteins, and diagnostic and therapeutic methods including the same
Apparatus for jetting droplet and apparatus for jetting droplet using nanotip
Method for forming a back-side illuminated image sensor with a junction insulation
  Randomly Featured Patents
Method and apparatus for efficient data transmission in a voice-over-data communication system
Isoprene-based hydrocarbon resin and adhesive composition containing the same
Plate-type chemical reactor
Process for preparing peptide nucleic acid probe using polymeric photoacid generator
Environmental board game
Apparatus for shifting filter plates in a filter press
Radio frequency beacon
Electronic two-hand safety system for power tools
Electric heating element utilizing ceramic PTC resistors for heating flooring media
Forming an electrode having reduced corrosion and water decomposition on surface using an organic protective layer