Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Colgan; Evan G.
Address:
Chestnut Ridge, NY
No. of patents:
63
Patents:


1 2










Patent Number Title Of Patent Date Issued
8569874 High memory density, high input/output bandwidth logic-memory structure and architecture October 29, 2013
A chip stack structure includes a logic chip having an active device surface, and memory slices of a memory unit vertically aligned such that a surface of the memory slices is oriented perpendicular to the active device surface of the logic chip. The chip stack structure also includes
8191245 Method of forming a land grid array (LGA) interposer June 5, 2012
A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a d
8171630 Method of producing a land grid array interposer May 8, 2012
A method of producing a land grid array (LGA) interposer structure includes mounting at least one interposer on a first surface of an electrically insulating carrier plane. The interposer selectively having a hemi-toroidal, conical, dome-shaped conic section, generally cylindrical or
8136242 Method of producing a land grid array interposer utilizing metal-on-elastomer March 20, 2012
A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and
8115302 Electronic module with carrier substrates, multiple integrated circuit (IC) chips and microchann February 14, 2012
Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (
8011563 Compliant mold fill head with integrated cavity venting and solder cooling September 6, 2011
A mold fill head includes a solder delivery head and an interface portion having a compliant portion secured to the solder delivery head and a dispensing region associated with the compliant portion. The dispensing region is formed with at least one aperture configured to interface with
7990711 Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silic August 2, 2011
A plurality of heat-dissipating electronic chips are arranged in a vertical chip stack. The electronic chips have electronic components thereon. A cold plate is secured to a back side of the chip stack. A silicon carrier sandwich, defining a fluid cavity, is secured to a front side o
7948077 Integrated circuit chip module with microchannel cooling device having specific fluid channel ar May 24, 2011
Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (
7928562 Segmentation of a die stack for 3D packaging thermal management April 19, 2011
An apparatus to reduce a thermal penalty of a three-dimensional (3D) die stack for use in a computing environment is provided and includes a substrate installed within the computing environment, a first component to perform operations of the computing environment, which is coupled to
7888786 Electronic module comprising memory and integrated circuit processor chips formed on a microchan February 15, 2011
Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (
7863070 Methods for encapsulating microelectromechanical (MEM) devices on a wafer scale January 4, 2011
Apparatus and methods are provided for enabling wafer-scale encapsulation of microelectromechanical (MEM) devices (e.g., resonators, filters) to protect the MEMs from the ambient and to provide either a controlled ambient or a reduced pressure. In particular, methods for wafer-scale
7836585 Method of operatively combining a plurality of components to form a land grip array interposer ( November 23, 2010
A method of operatively combining a plurality of components to form a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal
7832095 Method of forming a land grid array (LGA) interposer arrangement utilizing metal-on-elastomer he November 16, 2010
A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and
7832094 Method of operatively combining a plurality of components to form a land grip array interposer ( November 16, 2010
A method of operatively combining a plurality of components to form a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal
7823283 Method of forming a land grid array interposer November 2, 2010
A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a d
7665999 Land grid array (LGA) interposer structure of a moldable dielectric polymer providing for electr February 23, 2010
A module arrangement which includes a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cro
7658616 Groups of land grid interposers of different heights having metal-on elastomer hemi-torus shapes February 9, 2010
A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and interposer groupings of different height being mounted on a first surface of said carrier plane. Each interposer possesses a hemi-toroidal configuration in transverse cross-section and
7641479 Land grid array interposer (LGA) utilizing metal-on-elastomer hemi-torus and other multiple poin January 5, 2010
A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and
7491068 Land grid array (LGA) interposer groups of different heights utilizing metal-on-elastomer hemi-t February 17, 2009
A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a d
7491067 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple poin February 17, 2009
A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a d
7488182 Land grid array (LGA) interposer structure providing for electrical contacts on opposite sides o February 10, 2009
A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a d
7486513 Method and apparatus for cooling an equipment enclosure through closed-loop liquid-assisted air February 3, 2009
A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-densit
7484966 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple poin February 3, 2009
A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a d
7467951 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi torus and other multiple poin December 23, 2008
A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a d
7462039 LGA utilizing metal-on-elastomer hemi-torus having a slitted wall surface for venting gases December 9, 2008
A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a d
7458817 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple poin December 2, 2008
A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a d
7402052 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple poin July 22, 2008
A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a d
7381063 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple poin June 3, 2008
A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a d
7377790 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple poin May 27, 2008
A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a d
7374428 Land Grid Array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple poin May 20, 2008
A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a d
7361026 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple poin April 22, 2008
A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a d
7361025 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple poin April 22, 2008
A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a d
7361024 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple poin April 22, 2008
A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a d
7354277 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple poin April 8, 2008
A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a d
7344907 Apparatus and methods for encapsulating microelectromechanical (MEM) devices on a wafer scale March 18, 2008
Apparatus and methods are provided for enabling wafer-scale encapsulation of microelectromechanical (MEM) devices (e.g., resonators, filters) to protect the MEMs from the ambient and to provide either a controlled ambient or a reduced pressure. In particular, methods for wafer-scale
7342789 Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air March 11, 2008
A method and an apparatus for cooling, preferably within an enclosure, a diversity of heat-generating components, with at least some of the components having high-power densities and others having low-power densities. Heat generated by the essentially relatively few high-power-densit
7331796 Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple poin February 19, 2008
A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a d
7250576 Chip package having chip extension and method July 31, 2007
A chip package including a chip extension for containing thermal interface material (TIM) and improves chip cooling, and a related method, are disclosed. In particular, the chip package includes a chip, a cooling structure coupled to the chip via a TIM, and a chip extension may be th
7230334 Semiconductor integrated circuit chip packages having integrated microchannel cooling modules June 12, 2007
Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (
7193318 Multiple power density chip structure March 20, 2007
A multiple power density packaging structure with two or more semiconductor chips on a common wiring substrate having a common thermal spreader with a planar surface in thermal contact with the non-active surfaces of the chips. The semiconductor chips have different cooling requireme
7180179 Thermal interposer for thermal management of semiconductor devices February 20, 2007
A thermal interposer is provided for attachment to a surface of a semiconductor device. In one embodiment, the thermal interposer includes an upper plate having a bottom surface with a plurality of grooves and made of a material having high thermal conductivity, and a lower plate hav
7128472 Method and apparatus for providing optoelectronic communication with an electronic device October 31, 2006
An optoelectronic assembly for a computer system includes an electronic chip(s), a substrate, an electrical signaling medium, an optoelectronic transducer, and an optical coupling guide. The electronic chip(s) is in communication with the substrate, which is in communication with a first
7079393 Fluidic cooling systems and methods for electronic components July 18, 2006
A cooling system for an electronic component on a component carrier is provided. The system includes a frame, a spray manifold, and a sealing member. The frame has an opening and is connectable to the component carrier so that an annular area is defined between the opening and the el
7002247 Thermal interposer for thermal management of semiconductor devices February 21, 2006
A thermal interposer is provided for attachment to the back surface of a semiconductor device so as to give a very low thermal resistance. In one preferred embodiment, the thermal interposer has two plates containing wick structures such as grooves. The thermal interposer is integrated
6963119 Integrated optical transducer assembly November 8, 2005
An integrated optical transducer assembly includes a substrate and an optoelectronic array attached to the substrate. The optoelectronic array further includes a plurality of individual subunits bonded together to form a single array, with each of the subunits including a defined number
6955481 Method and apparatus for providing parallel optoelectronic communication with an electronic devi October 18, 2005
An optoelectronic assembly for an electronic system includes a support electronic chip set configured for at least one of providing multiplexing, demultiplexing, coding, decoding and optoelectronic transducer driving and receive functions. A first substrate having a first surface and an
6879098 Display fabrication using modular active devices April 12, 2005
A method for fabricating a display device patterns a conductive layer on a display substrate and forms pixel electrodes on the display substrate. A plate is employed for carrying separately fabricated active devices to the display substrate. The separately fabricated devices are connecte
6815270 Thin film transistor formed by an etching process with high anisotropy November 9, 2004
The present invention discloses a thin film transistor and a process for forming thereof by a high anisotropy etching process. A thin film transistor according to the present invention comprises a transistor element including a gate electrode, a gate insulating layer, a semiconductor
6789957 High-density optoelectronic transceiver assembly for optical communication data links September 14, 2004
An optoelectronic transceiver assembly includes a plurality of optical transmission devices coupled to a first end of a multimode optical fiber core. Each of the plurality of optical transmission devices generates light at a different wavelength with respect to one another. A wavelength
6752539 Apparatus and system for providing optical bus interprocessor interconnection June 22, 2004
An exemplary embodiment of the present invention is an apparatus for providing optical interprocessor communication. The apparatus comprises a multichip module and an optical module. The multichip module includes a substrate, an integrated circuit electrically connected to the substrate
1 2










 
 
  Recently Added Patents
Transparent zebrafish and preparation method thereof
Fluid-borne particle detector
Wafer processing method and system using multi-zone chuck
Radiation imaging device
Processing data using information embedded in a data request
Transfer of digital data through an isolation
Semiconductor device element formed on SOI substrate comprising a hollow region, and having capacitors in an electric field alleviation region
  Randomly Featured Patents
Vehicle center console
Pneumatically actuated walking doll
Double clutch assembly
Ionic liquid containing allylsulfonate anion
Latch device for trunk lid of vehicle trunk room
Dynamically rendering visualizations of data sets
Christmas tree cover
Nonvolatile semiconductor storage device
Method and device for obtaining a water-tight shield in the soil with the use of nozzles
System and control method for generating an image having a latent pattern with or without a background pattern