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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Choi; Duk-Yong
Address:
Anyang-shi, KR
No. of patents:
4
Patents:












Patent Number Title Of Patent Date Issued
6859602 Method for fabricating planar light waveguide circuits with vertical taper structure February 22, 2005
Disclosed is a method for fabricating planar light waveguide circuits, wherein the circuit has a structure that includes a substrate comprised of a core and under-clad layers, an optical circuit, and a plurality of arrayed waveguides coupled thereon. More specifically, the method include
6841860 Flip-chip bonding structure and method for making the same January 11, 2005
Disclosed are a flip-chip bonding structure for improving the vertical alignment of an optical device relative to a PLC and a flip-chip bonding method for achieving this structure. The flip-chip bonding structure includes: a semiconductor substrate; a lower-clad layer formed on the u
6799713 Flip-chip bonding structure and method for making the same October 5, 2004
Disclosed are a flip-chip bonding structure for improving the vertical alignment of an optical device relative to a PLC and a flip-chip bonding method for achieving this structure. The flip-chip bonding structure includes: a semiconductor substrate; a lower-clad layer formed on the u
6767756 Method of manufacturing tapered optical waveguide July 27, 2004
Disclosed is a method for manufacturing a tapered optical waveguide through which waveguides of different sizes are connected with each other optically. In the method, a photo-resist pattern having an inclined profile is formed on the core layer by means of a gray-scale mask, then th










 
 
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