Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Chocola; Jack
Address:
Lake Mary, FL
No. of patents:
5
Patents:












Patent Number Title Of Patent Date Issued
7635636 Wafer level packaging of materials with different coefficients of thermal expansion December 22, 2009
An electro-mechanical device package includes a cap material permanently bonded to a device wafer encapsulating an electromechanical device. An intermediate material is used to bond the device and capping material together at a low temperature, and a structure including the intermediate
7230512 Wafer-level surface acoustic wave filter package with temperature-compensating characteristics June 12, 2007
A SAW filter is fabricated at a wafer level for providing desirable temperature characteristics. The filter includes a piezoelectric substrate bonded to a carrier substrate, wherein the coefficient of thermal expansion of the carrier substrate is less than the coefficient of thermal
7213314 Method of forming a surface acoustic wave (SAW) filter device May 8, 2007
A SAW filter includes a piezoelectric substrate of Lithium Niobate or optionally Lithium Tantalate having a thickness of at least twice an acoustic wavelength. The piezoelectric substrate is bonded to a surrogate substrate of a silicon material. The surrogate substrate is characterized
7109635 Wafer level packaging of materials with different coefficients of thermal expansion September 19, 2006
An electro-mechanical device package includes a cap material permanently bonded to a device wafer encapsulating an electromechanical device. An intermediate material is used to bond the device and capping material together at a low temperature, and a structure including the intermediate
7105980 Saw filter device and method employing normal temperature bonding for producing desirable filter September 12, 2006
A SAW filter includes a piezoelectric substrate of Lithium Niobate or optionally Lithium Tantalate having a thickness of at least twice an acoustic wavelength. The piezoelectric substrate is bonded to a surrogate substrate of a silicon material. The surrogate substrate is characterized










 
 
  Recently Added Patents
Aggregating completion messages in a sideband interface
Color image display device, color filter substrate, color pixel array substrate, and electronic device
Prompt gap varying optical filter, analytical instrument, optical device, and characteristic measurement method
Enhanced claims damage estimation using aggregate display
Signal generator
Golf club cover
Physiological measuring system comprising a garment in the form of a sleeve or glove and sensing apparatus incorporated in the garment
  Randomly Featured Patents
Grid rail container transport and storage system
Metal and wood step ladder
Tamperproof classroom noise alarm
Dust removal from solar cells
Mobile information terminal
Homokinetic transmission joint
Amorphous aripiprazole and process for the preparation thereof
Linear motion rolling guide unit
Nonvolatile memory device
Exterior face of floor mat backing