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Inventor: Cho; Soon Jin
Address: Kyoungki-do, KR
No. of patents: 2
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 6400021 |
Wafer level package and method for fabricating the same |
June 4, 2002 |
| Disclosed is a wafer level package and a method for fabricating the wafer level package, in which the contact area between the ball land and the solder ball is enlarged, so that the adhesion force between them is highly strengthened. The wafer level package has a semiconductor chip havin |
| 6222259 |
Stack package and method of fabricating the same |
April 24, 2001 |
| Disclosed is a stack package and a method of manufacturing the same. The stack package of the present invention comprises a ceramic capsule. A pair of protruding portions are formed at both upper sides of the ceramic capsule. A first semiconductor chip is attached on the upper face of th |
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