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Inventor:
Chipalkatti; Jayprakash Vijay
Address:
Allen, TX
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
8102038 Semiconductor chip attach configuration having improved thermal characteristics January 24, 2012
A semiconductor chip 101 with surface 101b free of circuitry assembled on a metal carrier 102 by an attachment layer 103 with thickness 103a. Included in layer 103 are metal bodies 104 and an adhesive polymeric compound 105 between bodies 104. Metal bodies 104 form metal inter-diffus










 
 
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