Resources Contact Us Home
Chen; Yvon
Hsichih, TW
No. of patents:

Patent Number Title Of Patent Date Issued
7117587 Method for fabricating a substrate, including a plurality of chip package substrates October 10, 2006
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-lay
7075176 Chip package substrate having soft circuit board and method for fabricating the same July 11, 2006
A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are

  Recently Added Patents
Plants and seeds of corn variety CV294874
Conductor for transmitting electrical power
DL control channel structure enhancement
Methods and apparatus for clock signal synchronization in a configuration of series connected semiconductor devices
Catalyst composition comprising shuttling agent for ethylene multi-block copolymer formation
Optical scanner and image-forming device
  Randomly Featured Patents
Method and apparatus for predicting minimum stopping distance required to brake running vehicle
Drug-transfer device, drug-delivery system incorporating the same, methods of fabricating the same, and methods of enabling administration of a drug
Cache flush system and method
Constrained discrete-cosine-transform coefficients for better error detection in a corrupted MPEG-4 bitstreams
Digital video recording apparatus and method
Mouse pad method
Device for introducing medical instruments into a body
Buccal end tube
Vehicle boom assembly and method
Polyurethanes made from hydroxy-methyl containing fatty acids or alkyl esters of such fatty acids