Resources Contact Us Home
Chen; Yvon
Hsichih, TW
No. of patents:

Patent Number Title Of Patent Date Issued
7117587 Method for fabricating a substrate, including a plurality of chip package substrates October 10, 2006
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-lay
7075176 Chip package substrate having soft circuit board and method for fabricating the same July 11, 2006
A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are

  Recently Added Patents
Pre-fetching map data using variable map tile radius
Administrable compositions
Methods of prognosing a rheumatoid arthritis remission phenotype
Quinoline compounds and their use for treating viral infection
Polymeric structures comprising a siloxane
Random access point (RAP) formation using intra refreshing technique in video coding
  Randomly Featured Patents
Satellite communication system
Automated high-throughput seed sample processing system and method
Control system for a four-wheel drive transmission
Electromagnetic initiator coil
Tire and wheel servicing system
Single housing multi-sander assembly
Apparatus for contracting, or crimping stents
Flat faced bearing housing engaging flat faced pump rotor housing
Optical layer survivability and security system