Resources Contact Us Home
Chen; Yvon
Hsichih, TW
No. of patents:

Patent Number Title Of Patent Date Issued
7117587 Method for fabricating a substrate, including a plurality of chip package substrates October 10, 2006
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-lay
7075176 Chip package substrate having soft circuit board and method for fabricating the same July 11, 2006
A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are

  Recently Added Patents
Information processing apparatus, method for controlling information processing apparatus, and storage medium
Sensing device and electronic apparatus
Compounds, compositions and methods for reducing lipid levels
Single integrated circuit configured to operate both a capacitive proximity sensor device and a resistive pointing stick
Computer system for routing package deliveries
Tomlinson Harashima precoding with additional receiver processing in a multi-user multiple-input multiple-output wireless transmission system
Semiconductor device including insulating layer of cubic system or tetragonal system
  Randomly Featured Patents
Hydraulic brake system with an antiskid control apparatus
Turbine blade
System for comparing real-time data and modeling engine data to predict arc flash events
Process for fabricating self-aligned contact studs for semiconductor structures
Complementary logic gate device
Preparation of nitric acid
Copper interconnect structure having stuffed diffusion barrier
Robot tractors
System and method for correcting sampling errors associated with radiation source tuning rate fluctuations in swept-wavelength interferometry