Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Chen; Yvon
Address:
Hsichih, TW
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
7117587 Method for fabricating a substrate, including a plurality of chip package substrates October 10, 2006
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-lay
7075176 Chip package substrate having soft circuit board and method for fabricating the same July 11, 2006
A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are










 
 
  Recently Added Patents
Device, system, and method for logging near field communications tag interactions
Display unit and display method
Container
Tablet computer
Methods and systems for time-shifting content
Forming agent for gate insulating film of thin film transistor
Cylindrical lithium secondary battery comprising a contoured center pin
  Randomly Featured Patents
Method for making an electrode, resulting electrode and supercapacitor including same
Air bag system having a control system for determining the exact inflating time of an air bag
Tool holder
Method for visualizing feature ranking of a subset of features for classifying data using a learning machine
Handle and trim
Methods and systems for filtration
Device for placing a tower crane in weathervaning mode
Electrophotographic photoreceptor containing asymmetrical naphthalenetetracarboxylic acid diimide derivative as electron transporting material in a charge generating layer and electrophoto
Electronic multi-channel selection switch with common new-selection sensing device
Mold