Resources Contact Us Home
Chen; Yvon
Hsichih, TW
No. of patents:

Patent Number Title Of Patent Date Issued
7117587 Method for fabricating a substrate, including a plurality of chip package substrates October 10, 2006
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-lay
7075176 Chip package substrate having soft circuit board and method for fabricating the same July 11, 2006
A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are

  Recently Added Patents
Control system for an internal combustion engine
Variable delay line for delay locked loop
Method and apparatus for compensating QoS during handover by base station in wireless broadband access system
Specification of latency in programmable device configuration
Monitoring device for monitoring a display device
Base station apparatus and method for use in mobile communication system
Organic light emitting display apparatus
  Randomly Featured Patents
Cementitious compositions and a method of their use
Twig furniture
Method of fabricating thin film cells and printed circuit boards containing thin film cells using a screen printing process
Tumor marker
System and method for seamlessly providing video content to client systems over a network
Method for controlling movement of head in data storage device and disk drive employing the method
Narrow beam LED spotlight
Selectively configurable package for retaining separated items
Lead frame clamp for ultrasonic bonding
Image printer stylus bar, manufacturing method therefor and image printer device