Resources Contact Us Home
Chen; Yvon
Hsichih, TW
No. of patents:

Patent Number Title Of Patent Date Issued
7117587 Method for fabricating a substrate, including a plurality of chip package substrates October 10, 2006
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-lay
7075176 Chip package substrate having soft circuit board and method for fabricating the same July 11, 2006
A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are

  Recently Added Patents
Recording medium, playback device, integrated circuit
Complete context search system
Inhibitors of human immunodeficiency virus replication
Listing recommendation using generation of a user-specific query in a network-based commerce system
Methods of measuring cell viability in tissue engineered products
Bi-level switching with power packs
LED package with top and bottom electrodes
  Randomly Featured Patents
Polyelectrolyte nanolayers as diffusion barriers in semiconductor devices
Electro-optical device and electronic apparatus
Penta-lobed gas burner
2786, a novel human aminopeptidase
Low-dose iso-centering
Method of separating olefins from mixtures with paraffins
Portable radio
Adaptive transversal filter
Combination light device with insect control ingredient emission