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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Chen; Mary Y.
Address:
Oak Park, CA
No. of patents:
4
Patents:




Patent Number Title Of Patent Date Issued
7582536 Electronic device with reduced interface charge between epitaxially grown layers and a method fo September 1, 2009
An electronic device contains a substrate, a sub-collector supported by the substrate, an un-doped layer having a selectively implanted buried sub-collector and supported by the sub-collector, an As-based nucleation layer partially supported by the un-doped layer, a collector layer s
7531851 Electronic device with reduced interface charge between epitaxially grown layers and a method fo May 12, 2009
An electronic device contains a substrate, a sub-collector supported by the substrate, an un-doped layer having a selectively implanted buried sub-collector and supported by the sub-collector, an As-based nucleation layer partially supported by the un-doped layer, a collector layer s
7470619 Interconnect with high aspect ratio plugged vias December 30, 2008
Described is a method for forming a stackable interconnect. The interconnect is formed by depositing a first contact on a substrate; depositing a seed layer (SL) on the substrate; depositing a metal mask layer (MML) on the SL; depositing a bottom anti-reflection coating (BARC) on the
7259444 Optoelectronic device with patterned ion implant subcollector August 21, 2007
In one embodiment, an optoelectronic device is provided having a pin photo diode including a semi-insulating substrate or layer, with a patterned implant region of a first dopant type. The pin photo diode includes an upper layer having semiconductor material with a second dopant type. An


 
 
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