Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Chen; Huei-Jen
Address:
Yungho, TW
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
7117587 Method for fabricating a substrate, including a plurality of chip package substrates October 10, 2006
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-lay
7075176 Chip package substrate having soft circuit board and method for fabricating the same July 11, 2006
A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are










 
 
  Recently Added Patents
Programming of DIMM termination resistance values
Phase lock loop with injection pulse control
Methods circuits apparatuses and systems for facilitating access to online content
Processing biomass
Audio and music data transmission medium and transmission protocol
Bipolar transistor with diffused layer between deep trench sidewall and collector diffused layer
High density vertical structure nitride flash memory
  Randomly Featured Patents
Image display apparatus
Field emission cold cathode device and method for driving the same
Resin coated substrate using a short-set, high-flow melamine-formaldehyde impregnating resin
Board pieces, flexible wiring boards, and processes for manufacturing flexible wiring boards
Vehicle supplemental heating system including spool valve manifold
Device for allowing addition and replacement of jewelry strands
Wafer support pin for preventing slip dislocation during annealing of water and wafer annealing method using the same
Suction and irrigation handpiece and tip
Multistate triple-decker dyads in three distinct architectures for information storage applications
Wind-turbine blade and method for reducing noise in wind turbine