Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Chen; Huei-Jen
Address:
Yungho, TW
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
7117587 Method for fabricating a substrate, including a plurality of chip package substrates October 10, 2006
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-lay
7075176 Chip package substrate having soft circuit board and method for fabricating the same July 11, 2006
A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are










 
 
  Recently Added Patents
Sparse data compression
Organic light emitting display apparatus
Efficient paging in a wireless communication system
High brightness laser diode module
Method and apparatus for content-aware resizing of data chunks for replication
Water purification using energy from a steam-hydrocarbon reforming process
Method and apparatus for map transmission in wireless communication system
  Randomly Featured Patents
Solid-form additive systems dispersible in aqueous media
Artificial intervertebral disc flexibly oriented by spring-reinforced bellows
Analyte test strip for accepting diverse sample volumes
Waterproof rubber plug
Liquid jet recording head with a protective layer formed by converting the surface of a transducer into an insulating material
Methods of forming a semiconductor device that allow patterns in different regions that have different pitches to be connected
Selective delta validation of a shared artifact
Process for class IV-B metals ore reduction
Terpolymers of unsaturated sulfonates, N-vinylamides and ethylenic monomers
Angle broom