Resources Contact Us Home
Chen; Huei-Jen
Yungho, TW
No. of patents:

Patent Number Title Of Patent Date Issued
7117587 Method for fabricating a substrate, including a plurality of chip package substrates October 10, 2006
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-lay
7075176 Chip package substrate having soft circuit board and method for fabricating the same July 11, 2006
A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are

  Recently Added Patents
Patient programmer with automated MRI compatibility verification for active implantable medical device
Device for increasing chip testing efficiency and method thereof
Active matrix substrate, method for manufacturing same, and liquid crystal display apparatus
System and method for netbackup data decryption in a high latency low bandwidth environment
Image signal processing apparatus and image signal processing method
Image forming apparatus having exhaust fan
Vehicle headlight
  Randomly Featured Patents
CAD information management system and CAD information management method
Hybrid tuning circuit for continuous-time sigma-delta analog-to-digital converter
Dicalcium phosphate dihydrate having improved monofluorophosphate compatibility and process for the preparation thereof
Light emitting diode and method for manufacturing the same
Pattern transfer machine
Lining material and pipeline lining method
Cup dispenser
Method of dissolving cholesterol-rich calculi with short chain halogenated organic solvents and cosolvents
Level conversion for use in semiconductor device
Touch-free nozzle sealant removal