Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Chen; Huei-Jen
Address:
Yungho, TW
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
7117587 Method for fabricating a substrate, including a plurality of chip package substrates October 10, 2006
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-lay
7075176 Chip package substrate having soft circuit board and method for fabricating the same July 11, 2006
A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are










 
 
  Recently Added Patents
Pressure roller and fixing device equipped with the same
Efficient file system metadata scanning using scoped snapshots
Process for the preparation of diene polymers of statistical vinylarene-diene copolymers
(4946
Cantilevered probe detector with piezoelectric element
Methods, systems, and products for providing ring backs
Hydrostatic pad pressure modulation in a simultaneous double side wafer grinder
  Randomly Featured Patents
Trailer wheel lock
Voice detection apparatus
Cut-out integrated closure and forming method therefor
Compressed instruction format
Method and apparatus for determining burst errors in an error pattern
Method and apparatus for entity relationship visualization
Acoustic impedance log obtained from seismograms
Apparatus for stationary screening
Apparatus for controlling an operation of a shutter
Telescoping uncoupling lever