Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Chen; Huei-Jen
Address:
Yungho, TW
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
7117587 Method for fabricating a substrate, including a plurality of chip package substrates October 10, 2006
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-lay
7075176 Chip package substrate having soft circuit board and method for fabricating the same July 11, 2006
A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are










 
 
  Recently Added Patents
Chemically bonded carbon nanotube-polymer hybrid and nanocomposite thereof
Laser receiver for detecting a relative position
Laser protection polymeric materials
Prompt gap varying optical filter, analytical instrument, optical device, and characteristic measurement method
Driver circuit for driving semiconductor switches
Comb
Mobility management in a communications system
  Randomly Featured Patents
Method for treating organic waste matter
Window shade
Anodically bonded device structure
Pyrrolidino and piperidino benz ring substituted phthalides
Method of making pressure-sensitive transducer
Method for determining formation particle size distribution using well logging measurements
Apparatus for adjusting the slide stroke of a press machine
Multi-object fetch component
Heating device
Automated analyzers for estimation systems