Resources Contact Us Home
Chen; Huei-Jen
Yungho, TW
No. of patents:

Patent Number Title Of Patent Date Issued
7117587 Method for fabricating a substrate, including a plurality of chip package substrates October 10, 2006
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-lay
7075176 Chip package substrate having soft circuit board and method for fabricating the same July 11, 2006
A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are

  Recently Added Patents
Press nut
Method of enhancing corrosion resistance of hollow vessels
System for setting programmable parameters for an implantable hypertension treatment device
Composition comprising a mixture of dextro- and levo-amphetamines complexed with ion-exchange resin particles to form drug resin particles
Methods and compositions for inhibiting progression to chronic cardiac failure
Level shifter and method of using the same
Injection molding method and injection molding machine
  Randomly Featured Patents
Vehicle body having a strutting configuration at a bottom side of the vehicle body
AC/DC converter capable of actively restraining an inrush current
Stator lead wire connecting method
Defrosting system using compressed air
Bone screw
Swimming pool cover
Body support
System for calculating and displaying sales information
Disposable diaper