Resources Contact Us Home
Chen; Huei-Jen
Yungho, TW
No. of patents:

Patent Number Title Of Patent Date Issued
7117587 Method for fabricating a substrate, including a plurality of chip package substrates October 10, 2006
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-lay
7075176 Chip package substrate having soft circuit board and method for fabricating the same July 11, 2006
A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are

  Recently Added Patents
Piano keyboard with key touch point detection
Techniques for image segment accumulation in document rendering
Device for installing conducting components in structures
Planarizing agents and devices
Flood protection apparatus and container data center including the same
Vehicle lamp component
Wind energy system having a connection protection device
  Randomly Featured Patents
Portable radio receiver
Multiphase motor damping method and circuit arrangement
Television receiver stand
Use of a polysiloxane/polyurea block copolymer for the treatment of keratinous fibers
Container for precision substrate
System for improving the efficiency of an internal combustion engine of a vehicle
Method for data regeneration
Video recorder with field memory
Associative memory