Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Chen; Huei-Jen
Address:
Yungho, TW
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
7117587 Method for fabricating a substrate, including a plurality of chip package substrates October 10, 2006
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-lay
7075176 Chip package substrate having soft circuit board and method for fabricating the same July 11, 2006
A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are










 
 
  Recently Added Patents
Systems and methods for economic retirement analysis
Apparatus and method for information processing, program, and recording medium
Reverse mapping method and apparatus for form filling
Circuit and method for generating an AC voltage from a plurality of voltage sources having a temporally variable DC output voltage
Concentration measuring apparatus for hydrogen sulfide in gas flow, and method for determining sulfide ion
Apparatus and method for foreground detection
Biological analysis arrangement and approach therefor
  Randomly Featured Patents
Heat retaining hair curling system and method of styling
Taillight for a vehicle
Narrow band filter
Foot rest
Apparatus for controlling fuel injection of engine and method thereof
Oil-water monitor
System and method for anchoring an expandable tubular to a borehole wall
Magnetically actuated pilot valve
Identifying non-distinct names in a set of names
Portion for a LED lamp