Resources Contact Us Home
Chen; Huei-Jen
Yungho, TW
No. of patents:

Patent Number Title Of Patent Date Issued
7117587 Method for fabricating a substrate, including a plurality of chip package substrates October 10, 2006
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-lay
7075176 Chip package substrate having soft circuit board and method for fabricating the same July 11, 2006
A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are

  Recently Added Patents
Device for dosing dyes for the preparation of dyeing baths
Cosmetic container
Light source device, lighting device, and display device
Video processing method capable of performing predetermined data processing operation upon output of frame rate conversion with reduced storage device bandwidth usage and related video process
System and method for forming a support article
Print preview display of confirmation page with main page based on selected display method
System and method for automatically navigating a depth contour
  Randomly Featured Patents
Manufacturing method for optical recording medium and manufacturing device thereof
Shock-absorbing device for shoe or shoe pad
Power transmission apparatus
Composition for sealing of painted or metal surfaces
Conductive contact holder
Figural bottle opener
20 card deck poker game and method therefor
Electronic lock actuator with helical drive member
Energy efficient compact fluorescent reflector lamp