Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Chen; Huei-Jen
Address:
Yungho, TW
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
7117587 Method for fabricating a substrate, including a plurality of chip package substrates October 10, 2006
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-lay
7075176 Chip package substrate having soft circuit board and method for fabricating the same July 11, 2006
A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are










 
 
  Recently Added Patents
Solid-state imaging device and method for manufacturing the same
Computer product, information retrieval method, and information retrieval apparatus
System and method for interactive image-based modeling of curved surfaces using single-view and multi-view feature curves
Sparse data compression
Semiconductor devices and methods for changing operating characteristics and semiconductor systems including the same
Controlling a video window position relative to a video camera position
Oil extractor and the preparation method thereof
  Randomly Featured Patents
Method, computer program product and system for managing usage of marginal capacity of computer resources
Network controller
Fall arrest device for a fixed rope
Optical sheet and optimizing method thereof
Liquid crystal display device and method for fabrication thereof
Feeding arrangement for an axial flow rotary combine
Coaxial multicore receptacle
Direct wireless communication system and method of operation
Calling party identification announcement service
Transistor having a high-k metal gate stack and a compressively stressed channel