Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Chen; Huei-Jen
Address:
Yungho, TW
No. of patents:
2
Patents:












Patent Number Title Of Patent Date Issued
7117587 Method for fabricating a substrate, including a plurality of chip package substrates October 10, 2006
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-lay
7075176 Chip package substrate having soft circuit board and method for fabricating the same July 11, 2006
A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are










 
 
  Recently Added Patents
Luggage wheel housing with wheel
Toy
Multi-dimensional credibility scoring
Managing imaging of computing devices
Pattern forming method using printing device and method of manufacturing liquid crystal display device using the same
Opportunistic modem
Radio communication system, base station apparatus, terminal apparatus, and radio communication method for radio communication system
  Randomly Featured Patents
Use of saccadic eye motion to indicate the level of human interest in response to visual stimuli
Process for the preparation of 1-butene-3,4-diol
Video disc systems with plural preemphasis/deemphasis networks
Apparatus and method for protection of management frames
Voltage level translator circuit
Light and heat stabilizers for polyolefins
Low voltage-to-high voltage converter
Human KDEL receptor
Device for interferometric detection of surface structures
Sealing members for use in gas preheater