Resources Contact Us Home
Chen; Huei-Jen
Yungho, TW
No. of patents:

Patent Number Title Of Patent Date Issued
7117587 Method for fabricating a substrate, including a plurality of chip package substrates October 10, 2006
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-lay
7075176 Chip package substrate having soft circuit board and method for fabricating the same July 11, 2006
A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are

  Recently Added Patents
Plants and seeds of hybrid corn variety CH514730
Photoconductor cartridge
Computer systems and methods for the query and visualization of multidimensional databases
System and method for efficient association of a power outlet and device
Method for manufacturing photoelectric conversion device
Topology discovery, control channel establishment, and datapath provisioning within an aggregation network with centralized control
Method for computing an energy efficient route
  Randomly Featured Patents
Anatomical apron and method for illustrating surgical procedures
Lithographic apparatus and device manufacturing method
Process for preparing an enol silyl ether compound
Apparatus and method for the wet chemical treatment of a product and method for installing a flow member into the apparatus
Method and device for mounting a lithoplate using register pins
Portable demilitarization apparatus for segmenting ordnance
Methods and apparatus for filtering electromagnetic interference from a signal in an input/output port
Data storage device carrier and carrier tray
Mold aligning device for a compression molding machine
Device on a double disk lapping machine