Resources Contact Us Home
Chen; Huei-Jen
Yungho, TW
No. of patents:

Patent Number Title Of Patent Date Issued
7117587 Method for fabricating a substrate, including a plurality of chip package substrates October 10, 2006
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-lay
7075176 Chip package substrate having soft circuit board and method for fabricating the same July 11, 2006
A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are

  Recently Added Patents
Telephone line seizure module
Clothing fastener accessory
Nuclear fission reactor, a vented nuclear fission fuel module, methods therefor and a vented nuclear fission fuel module system
Method and device for surface scanning of a patient
Account managing device, image processing system, and storage medium
Method of patterning color conversion layer and method of manufacturing organic EL display using the patterning method
Organic electroluminescence device
  Randomly Featured Patents
Flavoring, fragance, skin texturizing and deodorant materials and method of making same
Computer keyboard casing
Management teaching game apparatus and method
Devices for controlling spinal cord modulation for inhibiting pain, and associated systems and methods, including controllers for automated parameter selection
Optical device with a dichroic polarizer and a multilayer optical film
Multi-peak speech processor
Stamping implement
Semiconductor device and method for fabricating the same
Automated system for performance analysis and fluorescence quantitation of samples
Opcode numbering for meta-data encoding