Resources Contact Us Home
Chen; Huei-Jen
Yungho, TW
No. of patents:

Patent Number Title Of Patent Date Issued
7117587 Method for fabricating a substrate, including a plurality of chip package substrates October 10, 2006
A method for fabricating a substrate, which includes a plurality of chip package substrates. One combined PCB includes a multi-layer rigid PCB and a soft PCB. The multi-layer rigid PCB is fixed on the soft PCB. At least one grooves or a pair is formed on an upper surface of the multi-lay
7075176 Chip package substrate having soft circuit board and method for fabricating the same July 11, 2006
A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are

  Recently Added Patents
Light emitting device and light emitting device package
Call admission control method and system
Method and system for streaming digital video content to a client in a digital video network
Processing biomass
Motilin-like peptide compound having transmucosal absorbability imparted thereto
Method for spore detection
Method and system for dynamically representing distributed information
  Randomly Featured Patents
Twin-clutch device
Mechanical component and hydraulic pressure control valve including the mechanical component
Method for enhancing the reception sensitivity in homodyne recievers
Analyzing instruction completion delays in a processor
Stage having controlled variable resistance load circuit for use in voltage controlled ring oscillator
Compounds substituted quinoline derivatives
Solid catalyst components for olefin polymerization
Method of producing crystallized glass from phosphate glass
Ventilator circuit for oxygen generating system