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Chen; Chung-Chih
Taipei, TW
No. of patents:

Patent Number Title Of Patent Date Issued
7709878 Capacitor structure having butting conductive layer May 4, 2010
A capacitor structure including a substrate, a butting conductive layer, a second dielectric layer, a plurality of openings, a bottom electrode layer, a capacitor dielectric layer, a top electrode layer, and a second metal interconnect layer is provided. The substrate has a first die
7257431 Electric swiveling mechanism for two axes August 14, 2007
The present invention discloses a portable multimedia player which comprises a panel, a base, and an electric swiveling mechanism for two axes combining the panel and the base. The electric swiveling mechanism further comprises a first swiveling mechanism and a second swiveling mecha
6500355 Wafer conductive structure for preventing plasma damage December 31, 2002
A conductive structure in a silicon wafer for preventing plasma damage. The wafer includes a plurality of dies and a plurality of scribe lines between the dies. The semiconductor substrate of this wafer further includes a plurality of patterned conductive layers. The conductive structure
6251804 Method for enhancing adhesion of photo-resist to silicon nitride surfaces June 26, 2001
A method for enhancing adhesion of photo-resist to silicon nitride surfaces is disclosed. An oxidation process is first performed on the surface of the semiconductor wafer using ozone-dissolved deionized water to transform most of the dangle bonds and Si-N bonds on the surface of the sil

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