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Inventor: Chen; April
Address: Taichung, TW
No. of patents: 2
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 6392425 |
Multi-chip packaging having non-sticking test structure |
May 21, 2002 |
| A multi-chip packaging substrate having a non-sticking test structure consists of a plurality of non-sticking test spots formed in the periphery zone outside the chip-packaging zone of a multi-chip packaging substrate. Each of these non-sticking test spots is electrically connected to an |
| 6291260 |
Crack-preventive substrate and process for fabricating solder mask |
September 18, 2001 |
| A crack-preventive substrate for fabricating a solder mask in a device site region includes a substrate, which has a top surface and a bottom surface, and a solder mask layer. The substrate is divided into a device site region and a periphery region. The solder mask layer, disposed on th |
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