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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Chang; Chia-Wei
Address:
Hsinchu, TW
No. of patents:
9
Patents:












Patent Number Title Of Patent Date Issued
8242266 Phosphorus-containing benzoxazines and preparing method thereof August 14, 2012
The Phosphorus-containing bisphenols and preparing method thereof are disclosed. A method for producing the phosphorus-containing bisphenol of the formula (1) includes reacting compounds respectively defined by a formula (a), (b), (c) and an acid catalyst to yield compounds of phosph
8134021 Phosphorus-containing bisphenols and preparing method thereof March 13, 2012
The Phosphorus-containing bisphenols and preparing method thereof are disclosed. A method for producing the phosphorus-containing bisphenol of the formula (1) includes reacting compounds respectively defined by a formula (a), (b), (c) and an acid catalyst to yield compounds of phosph
8058568 Circuit board and method for fabricating the same November 15, 2011
A circuit board and a method for fabricating the same are provided. The circuit board includes a core board, a first bonding layer disposed on the core board, and a first wiring layer disposed on the first bonding layer. The first bonding layer enables the first wiring layer to be bo
7706148 Stack structure of circuit boards embedded with semiconductor chips April 27, 2010
A stack structure of circuit boards embedded with semiconductor chips is proposed. At least two circuit boards are provided. Each of the circuit boards includes circuit layers formed on surfaces thereof and at least one opening embedded with a semiconductor chip, wherein, the circuit
7674986 Circuit board structure having capacitor array and embedded electronic component and method for March 9, 2010
A circuit board structure having a capacitor array and an embedded electronic component and a method for fabricating the same are proposed. Two carrier boards and a high dielectric constant material layer are provided, wherein the carrier boards have electronic components embedded th
7656040 Stack structure of circuit board with semiconductor component embedded therein February 2, 2010
A stack structure of circuit boards embedded with semiconductor components therein is proposed, which includes at least two semiconductor components embedded circuit boards, a plurality of conductive bumps, and at least one adhesive layer. The circuit boards are each formed with a circui
7619317 Carrier structure for semiconductor chip and method for manufacturing the same November 17, 2009
A carrier structure for a semiconductor chip and a method for manufacturing the same are disclosed. The method includes the following steps: providing a carrier board having at least one through cavity, wherein a removable film is formed on the surface of the carrier board, and a sem
7514770 Stack structure of carrier board embedded with semiconductor components and method for fabricati April 7, 2009
A stack structure of a carrier board embedded with semiconductor components and a method for fabricating the same are proposed. The stack structure includes first and second carrier boards having a through hole respectively, first and second semiconductors component disposed in throu
7507915 Stack structure of carrier boards embedded with semiconductor components and method for fabricat March 24, 2009
A stack structure of carrier boards embedded with semiconductor components and a method for fabricating the same are proposed. A first carrier board and a second carrier board, each of which having at least one through hole, are provided. A first protecting layer and a second protecting










 
 
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