| Patent Number |
Title Of Patent |
Date Issued |
| 7374811 |
Probe pad structure in a ceramic space transformer |
May 20, 2008 |
| A method for manufacturing a ceramic device is provided. The ceramic device comprises a ceramic layer. A polyimide layer is on the ceramic layer. The polyimide layer has disposed therein a plurality of copper vias. Each copper via is in physical contact with the ceramic layer. A plur |
| 7227268 |
Placement of sacrificial solder balls underneath the PBGA substrate |
June 5, 2007 |
| The present invention discloses techniques that improve the reliability of a flip packages that uses underfill encapsulation. One embodiment of the present invention describes a method and apparatus of packaging a flip chip by relocating the neutral plane of the package substrate away fr |
| 6829149 |
Placement of sacrificial solder balls underneath the PBGA substrate |
December 7, 2004 |
| The present invention discloses techniques that improve the reliability of a flip packages that uses underfill encapsulation. One embodiment of the present invention describes a method and apparatus of packaging a flip chip by relocating the neutral plane of the package substrate away fr |
| 6353182 |
Proper choice of the encapsulant volumetric CTE for different PGBA substrates |
March 5, 2002 |
| The present invention describes a method and apparatus for packaging a flip chip by matching the z-direction CTE of the IC solder joint with the z-direction CTE of the encapsulant. Consideration of the z-direction CTE's is important when determining the volumetric CTE of the encapsulant. |
| 6255599 |
Relocating the neutral plane in a PBGA substrate to eliminate chip crack and interfacial delamin |
July 3, 2001 |
| The present invention discloses techniques that improve the reliability of a flip packages that uses underfill encapsulation. One embodiment of the present invention describes a method and apparatus of packaging a flip chip by relocating the neutral plane of the package substrate away fr |
| 6188305 |
Transformer formed in conjunction with printed circuit board |
February 13, 2001 |
| A transformer comprises a printed circuit board having elongated conductors printed thereon, a ferrite core having a bottom mounted onto the printed circuit board and a flex circuit. The flex circuit comprises a dielectric sheet and elongated conductors printed on both faces of the sheet |
| 6000130 |
Process for making planar redistribution structure |
December 14, 1999 |
| A self-supporting redistribution structure for directly mounting a semi-conductor chip to a multilayer electronic substrate is separately fabricated and then laminated to the multilayer substrate. The redistribution structure comprises a dielectric layer having plated vias communicat |
| 5959348 |
Construction of PBGA substrate for flip chip packing |
September 28, 1999 |
| The present invention discloses techniques that improve the reliability of a flip packages that uses underfill encapsulation. One embodiment of the present invention describes a method and apparatus of packaging a flip chip by relocating the neutral plane of the package substrate away fr |
| 5774340 |
Planar redistribution structure and printed wiring device |
June 30, 1998 |
| A self-supporting redistribution structure for directly mounting a semi-conductor chip to a multilayer electronic substrate is separately fabricated and then laminated to the multilayer substrate. The redistribution structure comprises a dielectric layer having plated vias communicat |
| 5684392 |
System for extending operating time of a battery-operated electronic device |
November 4, 1997 |
| A system supplies power to and controls the frequency of electronic circuitry. The system comprises a DC source for supplying power to the electronic circuitry and a voltage controlled oscillator powered by the DC source. An output of the oscillator provides a system clock for the el |
