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Inventor:
Carlson; David W.
Address:
Windham, ME
No. of patents:
14
Patents:












Patent Number Title Of Patent Date Issued
7307021 Method for planarizing a thin film December 11, 2007
A layer of required material, such as polysilicon, is planarized by first forming a sacrificial layer of material, such as an oxide, on the layer of required material. The combined layers of required and sacrificial materials are then planarized using chemical-mechanical polishing until
7156727 Web-format polishing pads and methods for manufacturing and using web-format polishing pads in m January 2, 2007
A web-format polishing pad for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies, and methods for making and using such a web-format pad. In one aspect of the invention, a web-format polishing pad for planarizing a microelectronic substrate is
6817928 Method and apparatus for planarizing and cleaning microelectronic substrates November 16, 2004
A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first m
6749489 Method and apparatus for planarizing and cleaning microelectronic substrates June 15, 2004
A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first m
6634932 Web-format polishing pads and methods for manufacturing and using web-format polishing pads in m October 21, 2003
A web-format polishing pad for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies, and methods for making and using such a web-format pad. In one aspect of the invention, a web-format polishing pad for planarizing a microelectronic substrate is
6537136 Web-format polishing pads and methods for manufacturing and using web-format polishing pads in m March 25, 2003
A web-format polishing pad for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies, and methods for making and using such a web-format pad. In one aspect of the invention, a web-format polishing pad for planarizing a microelectronic substrate is
6458704 Light sensitive chemical-mechanical polishing method October 1, 2002
A chemical-mechanical polishing apparatus has a surface formed on a solid aggregate comprising a solid suspension of abrasive particles in a light sensitive material. An ultraviolet light source exposes a thin top layer of the surface and a developing fluid develops the exposed surface.
6458291 Light sensitive chemical-mechanical polishing aggregate October 1, 2002
A chemical-mechanical polishing apparatus has a surface formed on a solid aggregate comprising a solid suspension of abrasive particles in a light sensitive material. An ultraviolet light source exposes a thin top layer of the surface and a developing fluid develops the exposed surface.
6398630 Planarizing machine containing web-format polishing pad and web-format polishing pads June 4, 2002
A web-format polishing pad for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies, and methods for making and using such a web-format pad. In one aspect of the invention, a web-format polishing pad for planarizing a microelectronic substrate is
6394883 Method and apparatus for planarizing and cleaning microelectronic substrates May 28, 2002
A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first m
6368193 Method and apparatus for planarizing and cleaning microelectronic substrates April 9, 2002
A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first m
6358127 Method and apparatus for planarizing and cleaning microelectronic substrates March 19, 2002
A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first m
6277236 Light sensitive chemical-mechanical polishing apparatus and method August 21, 2001
A chemical-mechanical polishing apparatus has a surface formed on a solid aggregate comprising a solid suspension of abrasive particles in a light sensitive material. An ultraviolet light source exposes a thin top layer of the surface and a developing fluid develops the exposed surface.
6193588 Method and apparatus for planarizing and cleaning microelectronic substrates February 27, 2001
A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first m










 
 
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