| Patent Number |
Title Of Patent |
Date Issued |
| 5711987 |
Electronic coatings |
January 27, 1998 |
| The instant invention pertains to a multi-layer tamper proof electronic coating wherein the first layer is a protecting layer produced from preceramic silicon containing material and at least one filler. The second layer is a resin sealer coat produced from a sealer resin selected from |
| 5616202 |
Enhanced adhesion of H-resin derived silica to gold |
April 1, 1997 |
| Disclosed is a method of increasing the adhesion between gold and silica derived from hydrogen silsesquioxane resin. The method comprises joining the gold and silica followed by annealing under an oxidizing atmosphere. |
| 5611884 |
Flip chip silicone pressure sensitive conductive adhesive |
March 18, 1997 |
| A method and composition for joining flip chips back-side-up with respect to substrates by applying an adhesive between the active side of the flip chip and the substrate. The adhesive is a conductive silicone pressure sensitive adhesive containing (i) a silicone resin, (ii) a siloxane g |
| 5609925 |
Curing hydrogen silsesquioxane resin with an electron beam |
March 11, 1997 |
| A low temperature method of forming silica-containing ceramic coatings on substrates in which a coating containing hydrogen silsesquioxane resin is applied on a substrate and exposed to an electron beam for a time sufficient to convert the hydrogen silsesquioxane resin to the silica- |
| 5547703 |
Method of forming si-o containing coatings |
August 20, 1996 |
| Disclosed is a method for forming improved Si-O containing coatings on electronic substrates. The method comprises heating a hydrogen silsesquioxane resin successively under wet ammonia, dry ammonia and oxygen. The resultant coatings have improved properties such as low dielectric co |
| 5523163 |
Low dielectric constant coatings |
June 4, 1996 |
| Disclosed are Si--O containing ceramics having a dielectric constant less than or equal to about 3.2 which is stable over time. These properties render the ceramics valuable on electronic substrates. |
| 5516596 |
Method of forming a composite, article and composition |
May 14, 1996 |
| The present invention relates to a method of forming composite coatings on electronic substrates and the substrates coated thereby. The method comprises applying a coating comprising hydrogen silsesquioxane resin and a refractory fiber on an electronic substrate and heating the coated |
| 5458912 |
Tamper-proof electronic coatings |
October 17, 1995 |
| Disclosed is a method of forming tamper-proof coatings on electronic devices. The method comprises applying a coating of a silica precursor resin and a filler onto the electronic device, wherein the filler is one which reacts in an oxidizing atmosphere to liberate enough heat to damage |
| 5441765 |
Method of forming Si-O containing coatings |
August 15, 1995 |
| Disclosed is a method for forming improved Si--0 containing coatings on electronic substrate. The method comprises treating Si--0 containing ceramic coatings derived from hydrogen silsesquioxane resin with hydrogen gas. The resultant coatings have improved properties such as stable d |
| 5399441 |
Method of applying opaque coatings |
March 21, 1995 |
| Disclosed is a method of forming opaque coatings on integrated circuits. The method comprises selectively applying a coating of a silica precursor resin and a filler onto the integrated circuit and heating the coated circuit at a temperature sufficient to convert the silica precursor res |
| 5145723 |
Process for coating a substrate with silica |
September 8, 1992 |
| To form a coating of silica on a substrate, the substrate is coated with a silica precursor having a melting point between about 50.degree. and about 450.degree. C. The coating is heated to a temperature above its melting point in an inert environment to allow the coating to melt and flo |
