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Inventor: Cabahug; Elsie
Address: Mandaue, PH
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7285849 |
Semiconductor die package using leadframe and clip and method of manufacturing |
October 23, 2007 |
| A clip structure for a semiconductor package is disclosed. The clip structure includes a major portion, at least one pedestal extending from the major portion, a downset portion, and a lead portion. The downset portion is between the lead portion and the major portion. The clip struc |
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