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Inventor: Cabahug; Elsie Agdon
Address: Mandaue, PH
No. of patents: 2
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7560311 |
Robust leaded molded packages and methods for forming the same |
July 14, 2009 |
| A method for making a flip chip in a leaded molded package is disclosed. In some embodiments, the method includes using a leadframe structure including a die attach region and leads. The die attach region includes depressions proximate the inner portions of the leads, and an aperture in |
| 7122884 |
Robust leaded molded packages and methods for forming the same |
October 17, 2006 |
| A method for making a flip chip in a leaded molded package is disclosed. In some embodiments, the method includes using a leadframe structure including a die attach region and leads. The die attach region includes depressions proximate the inner portions of the leads, and an aperture in |
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