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Inventor: Cabahug; Elsie A.
Address: Mandaue, PH
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 6391687 |
Column ball grid array package |
May 21, 2002 |
| A semiconductor device including a substantially flat leadframe that includes a die attach area on a surface of the leadframe. A die including solder bumps is placed thereon and a plurality of columns surround at least a portion of the periphery of the die attach area. The die is pos |
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