Resources Contact Us Home
Bynum; Timothy J. A.
Glen Allen, VA
No. of patents:

Patent Number Title Of Patent Date Issued
7415387 Die and wafer failure classification system and method August 19, 2008
A system and method for classifying failures of semiconductor integrated circuit dies using a unique input vector created from die level characterization data to classify wafer (process related) and die level (defect related) patterns. The failure classification may then be used to a

  Recently Added Patents
Systems, methods, and apparatus to determine physical location and routing within a field of low power beacons
Integrated control system for stability control of yaw, roll and lateral motion of a driving vehicle using an integrated sensing system to determine longitudinal velocity
Advertising system and method
Address generation unit for accessing a multi-dimensional data structure in a desired pattern
Composition comprising a mixture of dextro- and levo-amphetamines complexed with ion-exchange resin particles to form drug resin particles
Establishing a social network
Churn prediction and management system
  Randomly Featured Patents
Introducer sheath with retainer
Anal filter
Car telephone set
Articulated vehicle made from several vehicle parts which are couplable together
Stent/graft assembly
Electromagnetic wave absorber molding material, electromagnetic wave absorber molded element and method of manufacturing same, and electromagnetic wave absorber
Thin film transistor substrate for display device and fabricating method thereof
Arrangement for contactless measurement of the velocity of a moving medium
Waveguide and optical cable module
Belt clamps for vehicle passenger restraint belts