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Inventor:
Bynum; Timothy J. A.
Address:
Glen Allen, VA
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
7415387 Die and wafer failure classification system and method August 19, 2008
A system and method for classifying failures of semiconductor integrated circuit dies using a unique input vector created from die level characterization data to classify wafer (process related) and die level (defect related) patterns. The failure classification may then be used to a










 
 
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