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Inventor: Bynum; Timothy J. A.
Address: Glen Allen, VA
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7415387 |
Die and wafer failure classification system and method |
August 19, 2008 |
| A system and method for classifying failures of semiconductor integrated circuit dies using a unique input vector created from die level characterization data to classify wafer (process related) and die level (defect related) patterns. The failure classification may then be used to a |
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