| Patent Number |
Title Of Patent |
Date Issued |
| 5856871 |
Film thickness mapping using interferometric spectral imaging |
January 5, 1999 |
| A method of determining the thickness map of a film (14) overlying a substrate (14). This method includes illuminating (10) the film simultaneously from different angles and analyzing spectral intensity of the radiation reflected by each point on the film (14). The analysis is effect |
| 5838014 |
Laser beam boresighting apparatus |
November 17, 1998 |
| Boresighting apparatus includes a laser, a thermal target having an absorbent surface for receiving the laser beam and converting it to a heat spot of infrared radiation, and an optical device for receiving and optically displaying the heat spot. The thermal target is anisotropic, ha |
| 5835214 |
Method and apparatus for spectral analysis of images |
November 10, 1998 |
| A method and apparatus for analyzing an optical image of a scene to determine the spectral intensity of each pixel thereof, by: collecting incident light from the scene; scanning the incident light; passing the scanned light through an interferometer which outputs modulated light cor |
| 5823681 |
Multipoint temperature monitoring apparatus for semiconductor wafers during processing |
October 20, 1998 |
| An emissivity compensating non-contact system for measuring the temperature of a semiconductor wafer. The system includes a semiconductor wafer emissivity compensation station for measuring the reflectivity of the wafer at discrete wavelengths to yield wafer emissivity in specific wa |
| 5539517 |
Method for simultaneously measuring the spectral intensity as a function of wavelength of all th |
July 23, 1996 |
| A method of analyzing an optical image of a scene to determine the spectral intensity of each pixel of the scene, which includes collecting incident light from the scene; (b) passing the light through an interferometer which outputs modulated light corresponding to a predetermined set of |
