| Patent Number |
Title Of Patent |
Date Issued |
| 7621757 |
Solderless electrical interconnection for electronic package |
November 24, 2009 |
| An electrical connector assembly and method of connecting an electrical connector to a substrate are provided. The electrical connector assembly includes a substrate having first electrical circuitry formed on a surface, an elastomer, and second electrical circuitry disposed at least |
| 7616448 |
Wrap-around overmold for electronic assembly |
November 10, 2009 |
| An improved overmolded electronic assembly includes a backplate provided with a recessed edge, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component |
| 7603770 |
Method of overmolding an electronic assembly having an insert-molded vertical mount connector he |
October 20, 2009 |
| An electronic assembly including a vertical mount connector header is overmolded to form an encapsulated module. Conductor pins retained in the connector header are coupled to a circuit board to support the connector header with respect to the circuit board, leaving an open space between |
| 7561436 |
Circuit assembly with surface-mount IC package and heat sink |
July 14, 2009 |
| A circuit assembly containing a surface mount (SM) IC package wire bonded to a substrate and configured to conduct heat from the package into a heat sink through a heat-conducting member instead of the substrate. The package contains an IC device with input/output pads on a surface there |
| 7553680 |
Methods to provide and expose a diagnostic connector on overmolded electronic packages |
June 30, 2009 |
| An overmolded electronic assembly is provided having a circuit board with electronic devices and a diagnostic connection. The diagnostic connection includes electrical conductors having a distal end projecting above a first side of the circuit board, for example, circuit pads having sold |
| 7537464 |
Electrical pin interconnection for electronic package |
May 26, 2009 |
| An electrical connector assembly and method of connecting an electrical connector to a substrate are provided. The electrical connector assembly includes a substrate having electrical circuitry, a shroud, and a plurality of conductive pins. The conductive pins are pressed into contac |
| 7486515 |
Fluid circulator for fluid cooled electronic device |
February 3, 2009 |
| An electronic device is provided having a bimetallic fluid circulator for circulating fluid coolant in relation to electrical circuitry to provide enhanced heat exchange. The fluid circulator includes a first thin sheet exhibiting a first coefficient of thermal expansion and the second t |
| 7485957 |
Fluid cooled encapsulated microelectronic package |
February 3, 2009 |
| An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant |
| 7473585 |
Technique for manufacturing an overmolded electronic assembly |
January 6, 2009 |
| A technique for manufacturing an electronic assembly includes a number of steps. Initially, a backplate with a cavity formed into a first side of the backplate is provided. Next, a substrate with a first side of an integrated circuit (IC) die mounted to a first side of the substrate is |
| 7447041 |
Compression connection for vertical IC packages |
November 4, 2008 |
| An improved vertical integrated circuit device package that eliminates or reduces the need for wire bond connections and/or solder connections is provided. The package includes a vertical device having electrodes on opposite surfaces, and a compressed spring member that is used to es |
| 7440282 |
Heat sink electronic package having compliant pedestal |
October 21, 2008 |
| An electronic package is provided for dissipating heat away from electronic devices. The package includes a substrate and electronic devices mounted on the substrate. The package also has a thermally conductive heat sink assembled over the electronic device. The heat sink includes co |
| 7422448 |
Surface mount connector |
September 9, 2008 |
| A surface mount connector and assembly including the surface mount connector is shown and described. The assembly comprises a substrate and a connector including a carrier, and at least one electrical connecting element having first and second ends, wherein at least a portion of the |
| 7364684 |
Method of making an encapsulated microelectronic package having fluid carrying encapsulant chann |
April 29, 2008 |
| A method of making a fluid cooled microelectronic package in which fluid is circulated through the package in fluid-carrying channels defined at least in part by voids in an encapsulant that surrounds the package components. Preferably, the encapsulant channels are defined in part by |
| 7352070 |
Polymer encapsulated electrical devices |
April 1, 2008 |
| Improved encapsulated, overmolded and/or underfilled electrical components having a complete encapsulation, overmolding and/or underfilling with a coefficient of thermal expansion that is uniform and substantially free of gradients includes a polymeric matrix and an inorganic filler havi |
| 7307841 |
Electronic package and method of cooling electronics |
December 11, 2007 |
| An electronic package having circulated submersed cooling fluid and method are provided. The electronic package has a housing defining a sealed enclosure and electronic devices located in the housing. The electronic devices have thermal emitting electrical circuitry. A dielectric fluid, |
| 7268429 |
Technique for manufacturing an overmolded electronic assembly |
September 11, 2007 |
| A technique for manufacturing an electronic assembly uses a mold that has a first mold portion and a second mold portion. The first mold portion includes a plurality of spaced mold pins extending from an inner surface. A cavity of the first and second mold portions provides a mold cavity |
| 7230832 |
Cooled electronic assembly and method for cooling a printed circuit board |
June 12, 2007 |
| A cooled electronic assembly includes an integrated-circuit device carrier (such as a printed circuit board), a device (such as a flip chip), a liquid pump, a molding material, a heat exchanger, and a cover. The device and the liquid pump are electrically connected to the integrated- |
| 7227758 |
Printed circuit board assembly with integrated connector |
June 5, 2007 |
| A printed circuit board (PCB) assembly includes a PCB and a first integrated conductive bus structure extending from a first edge of the PCB. The PCB connects a plurality of electronic components and includes a plurality of conductive layers, each separated by a non-conductive layer. |
| 7205653 |
Fluid cooled encapsulated microelectronic package |
April 17, 2007 |
| An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips. The encapsulant |
| 7202571 |
Electronic module with form in-place pedestal |
April 10, 2007 |
| An electronic module includes a substrate, at least one surface mounted integrated circuit (IC) component and an underfill material. The substrate includes a plurality of electrically conductive traces, formed on at least one surface of the substrate, and the component is electricall |
| 7134194 |
Method of developing an electronic module |
November 14, 2006 |
| An electronic module and method that enable circuitry required by one form of the module (e.g., a developmental unit) to be omitted in a second form of the module (e.g., a production unit), without necessitating additional changes in the module. The electronic module includes a motherboa |
| 7132746 |
Electronic assembly with solder-bonded heat sink |
November 7, 2006 |
| A process and electronic assembly for conducting heat from a semiconductor circuit device mounted to a substrate. The substrate is supported by a housing member equipped with a heat-conductive member. A surface of the device opposite the substrate is bonded to the heat-conductive member |
| 6905349 |
Technique for connector to printed circuit board decoupling to eliminate flexure |
June 14, 2005 |
| An electronic assembly and/or a mold is constructed to reduce deflection and resultant damage to components and/or an associated printed circuit board of the electronic assembly when the electronic assembly is overmolded. |
| 6875636 |
Wafer applied thermally conductive interposer |
April 5, 2005 |
| A thermally conductive film is attached to an integrated circuit (IC) wafer through a number of steps. Initially, a thermally conductive film is positioned on a first side of a block. Next, an IC wafer that includes a plurality of chips is positioned with its non-active side in contact w |
| 6833628 |
Mutli-chip module |
December 21, 2004 |
| A package and packaging method that incorporates multiple surface-mounted devices mounted to the package, which in turn can be mounted onto a circuit board. The package generally includes a pair of laminate substrates that together form a chip carrier and input/output (I/O) interface |
| 6811892 |
Lead-based solder alloys containing copper |
November 2, 2004 |
| A tin-lead solder alloy containing copper and optionally silver as its alloying constituents. The solder alloy consists essentially of, by weight, about 55% to about 75% tin, about 11% to about 44% lead, up to about 4% silver, nickel, palladium, platinum and/or gold, greater than 1% |
| 6807731 |
Method for forming an electronic assembly |
October 26, 2004 |
| An overmolded electronic assembly having an electromagnetic interference shield, in the form of a thin metal film or foil, coupled to the top of or within an overmolded body. The shield effectively reduces the amount of electromagnetic interference ("EMI") emissions from penetrating with |
| 6779260 |
Overmolded electronic package including circuit-carrying substrate |
August 24, 2004 |
| An overmolded electronic package includes a circuit-carrying substrate and a connector housing or shroud interconnected via a suitable interconnection arrangement. Some embodiments may include a backplate affixed to the substrate and, in some cases, also to the connector housing or s |
| 6693239 |
Overmolded circuit board with underfilled surface-mount component and method therefor |
February 17, 2004 |
| An overmolded circuit board assembly and a method for forming the assembly. The assembly and method entail overmolding both surfaces of a circuit board and underfilling at least one surface-mount circuit device attached to at least one surface of the board with solder bump connections, w |
| 6619536 |
Solder process and solder alloy therefor |
September 16, 2003 |
| A solder alloy containing indium, lead, silver and copper as its alloying constituents, and a soldering process employing the solder alloy. The solder alloy consists essentially of, by weight, about 50% to about 65% indium, about 0.5% to about 3.0% silver, up to about 3.0% copper, the |
| 6593527 |
Integrated circuit assembly with bar bond attachment |
July 15, 2003 |
| An integrated circuit assembly 10 is provided, including a substrate 14 having at least one substrate contact surface 18, an integrated circuit device 12 having at least one first contact surface 16, and a bar bond element 22. The bar bond element 22 provides communication between the at |
| 6570260 |
Solder process and solder alloy therefor |
May 27, 2003 |
| A solder alloy containing indium, lead, silver and copper as its alloying constituents, and a soldering process employing the solder alloy. The solder alloy consists essentially of, by weight, about 50% to about 65% indium, about 0.5% to about 3.0% silver, up to about 3.0% copper, the |
| 5562498 |
Flexible capacitor filter |
October 8, 1996 |
| A flexible capacitor is provided which is suitable for use in conjunction with a magnetic core for forming a CLC or pi filter, such as the type used for electrical connectors in the engine control hardware for an automobile. The flexible capacitor is generally composed of a flexible |
| 5491364 |
Reduced stress terminal pattern for integrated circuit devices and packages |
February 13, 1996 |
| A terminal pattern is provided for an integrated circuit device, such as a ball grid array package or an integrated circuit flip chip. The terminal pattern is composed of a number of terminals arranged in concentric arrays, each array having a substantially circular shape and being c |
