| Patent Number |
Title Of Patent |
Date Issued |
| 7619107 |
Copper (II) complexes for deposition of copper films by atomic layer deposition |
November 17, 2009 |
| The present invention relates to novel 1,3-diimines and 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an atomic layer deposition process. |
| 7550179 |
Method of copper deposition from a supercritical fluid solution containing copper (I) complexes |
June 23, 2009 |
| Methods of depositing a copper film onto the surface of a substrate from a supercritical solution containing copper-containing precursors having monoanionic bidentate and neutral monodentate ligands, which comprise contacting the substrate with the solution; heating the substrate to a |
| 7388113 |
Volatile copper(II) complexes for deposition of copper films by atomic layer deposition |
June 17, 2008 |
| The present invention relates to a process for the synthesis of novel 1,3-diimine copper complexes using amino-imines and novel amino-imines. |
| 7268365 |
Volatile copper (II) complexes and reducing agents for deposition of copper films by Atomic Laye |
September 11, 2007 |
| The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process. |
| 7186835 |
Composition comprising amino-imine compounds |
March 6, 2007 |
| The composition relates to amino-imine compounds used in the formation of 1,3-diimine copper complexes for deposition of copper films. |
| 7087774 |
Volatile copper(II) complexes and reducing agents for deposition of copper films by atomic layer |
August 8, 2006 |
| The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process. |
| 6939578 |
Volatile copper(II) complexes for deposition of copper films by atomic layer deposition |
September 6, 2005 |
| The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process. This invention also provides a process for making amino-imines a |
