A method for fabricating a transistor structure with a first and a second bipolar transistor having different collector widths is presented. The method includes providing a semiconductor substrate, introducing a first buried layer of the first bipolar transistor and a second buried layer
The present invention provides a method for parallel production of an MOS transistor in an MOS area of a substrate and a bipolar transistor in a bipolar area of the substrate. The method comprises generating an MOS preparation structure in the MOS area, wherein the MOS preparation st
During the production of integrated semiconductor structures, it is often necessary to differently dope immediately adjacent regions. A method is provided for producing two adjacent regions of a predetermined area in an integrated semiconductor, whereby a first region of the two adjacent
The bipolar transistor is produced such that a connection region of its base is provided with a silicide layer, so that a base resistance of the bipolar transistor is small. No silicide layer is produced between an emitter and an emitter contact and between a connection region of a c
