| Patent Number |
Title Of Patent |
Date Issued |
| 7553695 |
Method of fabricating a package for a micro component |
June 30, 2009 |
| Techniques are disclosed for fabricating a relatively thin package for housing a micro component, such as an opto-electronic or MEMs device. The packages may be fabricated in a wafer-level batch process. The package may include hermetically sealed feed-through electrical connections |
| 7415180 |
Accurate positioning of components of an optical assembly |
August 19, 2008 |
| A passive alignment technique is disclosed to facilitate accurate positioning of components of an optical assembly. In one aspect, a method includes directing light onto components of an optical assembly in which a first component includes a first pattern of marks with a first freque |
| 7388285 |
Hermetically sealed package for optical, electronic, opto-electronic and other devices |
June 17, 2008 |
| Techniques are disclosed for hermetically sealing one or more devices within a package. According to one aspect, a lid is attached to a substrate on which one or more devices are provided such that the devices are encapsulated within an area defined by the substrate and the lid. A su |
| 7209235 |
Accurate positioning of components of a optical assembly |
April 24, 2007 |
| A passive alignment technique is disclosed to facilitate accurate positioning of components of an optical assembly. In one aspect, a method includes directing light onto components of an optical assembly in which a first component includes a first pattern of marks with a first freque |
| 7109580 |
Hermetically sealed package for optical, electronic, opto-electronic and other devices |
September 19, 2006 |
| Techniques are disclosed for hermetically sealing one or more devices within a package. According to one aspect, a lid is attached to a substrate on which one or more devices are provided such that the devices are encapsulated within an area defined by the substrate and the lid. A su |
