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Blessing; Patrick
Thalwil, CH
No. of patents:

Patent Number Title Of Patent Date Issued
8166637 Apparatus for mounting a flip chip on a substrate May 1, 2012
An apparatus for mounting semiconductor chips as flip chips on a substrate includes a chip supply, a pick-and-place system with a bonding head having a chip gripper, a flipping apparatus operable to rotate the chip from a first position to a second (flipped) position through an angle
8133823 Method for picking up semiconductor chips from a wafer table and method for mounting semiconduct March 13, 2012
The invention relates to a method for picking up semiconductor chips from a wafer table and, optionally, their mounting on a substrate by means of a pick-and-place system. The position and orientation of the semiconductor chip to be mounted next are determined by means of a first cam
7597234 Method for mounting a flip chip on a substrate October 6, 2009
The invention concerns a method for mounting a semiconductor chip with bumps on one surface onto a substrate location of a substrate, whereby the bumps are brought into contact with corresponding pads on the substrate location. Reference marks are attached to the bondhead that enable
7193727 Apparatus and method for mounting or wiring semiconductor chips March 20, 2007
An apparatus for mounting semiconductor chips onto a substrate contains a measuring station for the contactless measurement of the height of the surface of the mounted semiconductor chip facing away from the substrate at a minimum of three locations. From this, at least one parameter is

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