| Patent Number |
Title Of Patent |
Date Issued |
| 8166637 |
Apparatus for mounting a flip chip on a substrate |
May 1, 2012 |
| An apparatus for mounting semiconductor chips as flip chips on a substrate includes a chip supply, a pick-and-place system with a bonding head having a chip gripper, a flipping apparatus operable to rotate the chip from a first position to a second (flipped) position through an angle |
| 8133823 |
Method for picking up semiconductor chips from a wafer table and method for mounting semiconduct |
March 13, 2012 |
| The invention relates to a method for picking up semiconductor chips from a wafer table and, optionally, their mounting on a substrate by means of a pick-and-place system. The position and orientation of the semiconductor chip to be mounted next are determined by means of a first cam |
| 7597234 |
Method for mounting a flip chip on a substrate |
October 6, 2009 |
| The invention concerns a method for mounting a semiconductor chip with bumps on one surface onto a substrate location of a substrate, whereby the bumps are brought into contact with corresponding pads on the substrate location. Reference marks are attached to the bondhead that enable |
| 7193727 |
Apparatus and method for mounting or wiring semiconductor chips |
March 20, 2007 |
| An apparatus for mounting semiconductor chips onto a substrate contains a measuring station for the contactless measurement of the height of the surface of the mounted semiconductor chip facing away from the substrate at a minimum of three locations. From this, at least one parameter is |
