| Patent Number |
Title Of Patent |
Date Issued |
| RE38181 |
Dehumidifying mechanism for auto air conditioner with improved space utilization and thermal eff |
July 15, 2003 |
| An improved dehumidification system for automotive use includes a rotating, wheel like heat exchanger with axially open cells that carry a water adsorbing material. Opposed ambient air and heated air flows, covering opposite halves of the wheel, continually adsorb water on one side and a |
| 7604040 |
Integrated liquid cooled heat sink for electronic components |
October 20, 2009 |
| A fluid heat exchanger unit cools an electronic device with a cooling fluid supplied to an upper portion of a cooling housing. A refrigerant is disposed in a lower portion of the cooling housing for liquid-to-vapor transformation. A partition divides the upper portion of the cooling |
| 7597135 |
Impingement cooled heat sink with low pressure drop |
October 6, 2009 |
| Two embodiments of a heat exchanger assembly for cooling an electronic device are shown respectively in FIGS. 1 and 3 and each comprises a housing, a plurality of high fins, a plurality of low fins, a nozzle plate, an inlet, at least one outlet, a primary nozzle, and a plurality of s |
| 7556089 |
Liquid cooled thermosiphon with condenser coil running in and out of liquid refrigerant |
July 7, 2009 |
| The invention provides a fluid heat exchange assembly comprising a housing containing a liquid refrigerant presenting a surface. A tube is coiled in adjacent coils around an axis parallel to the surface of the liquid refrigerant with a first sector of each coil disposed below the liquid |
| 7556088 |
Thermosiphon for laptop computer |
July 7, 2009 |
| A heat exchanger assembly for cooling an electronic element includes an oblong condensing tube extending between ends to define an upper chamber downwardly bowed through an upwardly extending arc and a lower chamber upwardly bowed through a downwardly extending arc for dissipating heat. |
| 7537151 |
Method of making high performance heat sinks |
May 26, 2009 |
| A method of heat sink manufacture in which the crests of a conductive fin are nested down into close fitting grooves in a flat, conductive base plate, with small interface gaps G. A compressive material is set inside the fin crests and the grooves, viscous enough to not intrude into the |
| 7520317 |
Orientation insensitive compact thermosiphon with a remote auxiliary condenser |
April 21, 2009 |
| A heat exchanger assembly is provided including a primary housing having a plurality of primary condensing fingers extending upwardly from and perpendicular to a horizontal axis and disposed circumferentially about a primary axis. A tube extends radially from the primary axis along the |
| 7509995 |
Heat dissipation element for cooling electronic devices |
March 31, 2009 |
| A heat dissipation element for cooling an electronic device is disclosed. The heat dissipation element has a top surface and a bottom surface for mounting the electronic device to be cooled thereto. The top surface defines a heat dissipation area for dissipating heat from the electronic |
| 7506682 |
Liquid cooled thermosiphon for electronic components |
March 24, 2009 |
| A fluid heat exchanger assembly cools an electronic device with a cooling fluid supplied from a heat extractor (R, F) to an upper portion of a housing. A refrigerant is disposed in a lower portion of the housing for liquid-to-vapor transformation. A partition divides the upper portion of |
| 7497249 |
Thermosiphon for laptop computer |
March 3, 2009 |
| A heat exchanger assembly is provided including a multi-function boiling chamber having a top wall and a bottom wall parallel to the top wall and a first side wall and a second side wall both extending inwardly from the bottom wall to the top wall and a pair of end walls closing the cham |
| 7477516 |
Air cooled computer chip |
January 13, 2009 |
| A cooling assembly includes a housing supporting a nozzle for directing cooling air over an electronic component. A casing rotatably supports a shaft, which in turn, supports a compressor, an expander, and an electric motor, for circulating air and delivering the cooling air to the nozzl |
| 7475718 |
Orientation insensitive multi chamber thermosiphon |
January 13, 2009 |
| A hermetically sealed housing includes a plurality of inner walls extending radially from a central post to a circular outer wall, thereby defining a plurality of pie shaped chambers, each independently containing a refrigerant. At least one of the chambers is always in position to r |
| 7467657 |
Compact modular CPU cooling unit |
December 23, 2008 |
| A modular CPU cooling unit designed to fit within the available space within an existing box or cabinet containing a CPU. The fan, pump and liquid to air cross flow heat exchanger are fitted within the available volume with the fan spaced away from the heat exchanger a suitable dista |
| 7461690 |
Optimally shaped spreader plate for electronics cooling assembly |
December 9, 2008 |
| A spreader plate for an electronic component cooling assembly has a flat lower surface and a substantially arcuate upper surface of larger surface area than the lower surface which is generally convex and arcuate in cross section, and which decreases in thickness, as measured between the |
| 7438124 |
Evaporative cooling system for a data-communications cabinet |
October 21, 2008 |
| An electronics cabinet for storing a plurality of electronic devices therein is provided and includes a fan and an evaporative cooler. The fan draws a flow of air into the cabinet, circulates the flow of air through the evaporative cooler, and then across the electronic devices for r |
| 7424906 |
High performance thermosiphon with internally enhanced condensation |
September 16, 2008 |
| A thermosiphon cooling assembly includes a refrigerant disposed in a lower portion of a housing for undergoing a liquid-to-vapor-to-condensate cycle. A mixing device is disposed within the lower portion of the housing for increasing the transfer of heat from the electronic device dur |
| 7422052 |
Low profile thermosiphon |
September 9, 2008 |
| A thermosiphon cooling assembly for dissipating heat generated by an electronic device includes a housing having a housing top, housing bottom and opposing sides. The opposing sides extend between the housing top and the housing bottom to define a low profile entrance and a low profile |
| 7406999 |
Capillary-assisted compact thermosiphon |
August 5, 2008 |
| A thermosiphon cooling assembly cools an electronic device with a conical condensing tube disposed about a curved central axis curving upwardly from a top of the evaporating unit to an upper distal end and a shroud disposed outward of an exterior surface of the condensing tube at the |
| 7331380 |
Radial flow micro-channel heat sink with impingement cooling |
February 19, 2008 |
| A heat sink removes heat from an electronic device and comprises a base, a lid. An inner ring of first fins extend radially outwardly first length from an inner circle and extend axially a first height from the top surface of the base, and an outer ring of second fins extend radially |
| 7331378 |
Microchannel heat sink |
February 19, 2008 |
| The invention provides a heat sink for flowing coolant into inlet manifold channels extending into a inlet edge of a manifold where the flow is forced downward into parallel and spaced micro-channels extending across the manifold channels and re-directing the coolant up into and out of |
| 7305834 |
Vortex tube cooler |
December 11, 2007 |
| The invention provides an apparatus for moving thermal energy with respect to at least one of a beverage and a food product positioned in a vehicle or a stationary beverage machine. The apparatus includes a vortex tube positionable in a vehicle or a stationary beverage machine. The vorte |
| 7281390 |
Self-powered evaporative cooler |
October 16, 2007 |
| An indirect evaporative cooler assembly includes staggered wet and dry channels. An electric fan moves air through the assembly. Air passes through the wet channels where a material wicks moisture stored in a reservoir into the wet channels. As a result, the side walls of the wet cha |
| 7280363 |
Apparatus for controlling thermal interface between cold plate and integrated circuit chip |
October 9, 2007 |
| The invention provides a heat sink device for receiving heat generated by an electrical chip. The heat sink device includes a cold plate having a bottom surface for receiving heat from the electrical chip and a top surface opposite of the bottom surface. The heat sink device also inc |
| 7278471 |
Multi-layered micro-channel heat sink |
October 9, 2007 |
| The subject invention provides a heat sink for a liquid cooling system. The heat sink includes a spreader plate for contacting an electronic device and a body having a plurality of channels extending through the body and arranged in layers. Each layer includes a quantity of the chann |
| 7278468 |
Heat sink with multiple coolant inlets |
October 9, 2007 |
| The subject invention provides a heat sink for cooling electronic devices. The heat sink includes an upper chamber and a lower chamber separated by a baffle therebetween. The lower chamber includes a base having a central axis and a plurality of curvilinear fins disposed radially about t |
| 7269011 |
Impingement cooled heat sink with uniformly spaced curved channels |
September 11, 2007 |
| A heat sink assembly for removing heat from an electronic device and comprising a base, a lid in spaced relationship with and parallel to the base, and an outer wall spiraling radially outwardly about an inlet axis from an inner exit position to an outer exit position to define a tan |
| 7267162 |
Laminated evaporator with optimally configured plates to align incident flow |
September 11, 2007 |
| The invention provides a heat exchanger having a plurality of plates stacked in alternating mirrored relation with one another. Each of the plurality of plates has a plate length extending along a plate longitudinal axis between first and second ends. Each of the plurality of plates |
| 7263848 |
Heat pump system |
September 4, 2007 |
| A heat pump is operable in a heating mode and a cooling mode and includes two identical heat exchangers. The heat exchangers alternate between operating as a condenser and an evaporator as the heat pump switches between the heating mode and the cooling mode. The heat exchangers inclu |
| 7228989 |
High efficiency beverage vending machine |
June 12, 2007 |
| The invention provides a vending machine for cooling food products. The vending machine includes a housing defining an interior. The vending machine also includes a plurality of holding members substantially thermally isolated from one another and disposed in the interior. Each of th |
| 7213636 |
Cooling assembly with impingement cooled heat sink |
May 8, 2007 |
| The subject invention provides a cooling assembly for removing heat from an electronic device. The cooling assembly includes a heat sink having a base plate and a plurality of fins extending upwardly from the base plate to a top extremity. A nozzle directs a flow of cooling fluid onto th |
| 7204299 |
Cooling assembly with sucessively contracting and expanding coolant flow |
April 17, 2007 |
| A fluid heat exchanger assembly having an upper wall and a lower wall extending between the inlet and the outlet for establishing a direction of flow to cool an electronic device. A plurality of projections extend linearly transversely across the direction of flow to define rows of p |
| 7174722 |
Stirling cycle beverage cooler |
February 13, 2007 |
| The invention provides a heat exchanger operable, for example, with Stirling cooling system. The heat exchanger includes a first member having an inner surface defining a flow path for a working fluid. The first member also includes an outer surface spaced from the inner surface. The |
| 7143816 |
Heat sink for an electronic device |
December 5, 2006 |
| A heat sink for an electrical device is distinguished by a confining plate extending parallel to and along each lateral side of fins and extending upwardly from a top surface of a base to a bottom surface of a lid to define an outlet-chamber extending from the outer ends of the fins and |
| 7119434 |
Efficiency CPU cooling arrangement |
October 10, 2006 |
| A CPU cooling assembly having a first, covering layer of conductive material above the upper surface of an enclosed, heat producing chip and a third, upper layer of conductive material (a heat sink base plate) thermally bonded to the first by an intermediate, second layer of thin, co |
| 7080683 |
Flat tube evaporator with enhanced refrigerant flow passages |
July 25, 2006 |
| A heat exchanger for a heating, ventilating and air conditioning system comprises a plurality of heat exchange tubes extending between a pair of spaced header tanks and arranged in groups of tubes with varying number of tubes in each group to cause a refrigerant to flow in multiple passe |
| 7077189 |
Liquid cooled thermosiphon with flexible coolant tubes |
July 18, 2006 |
| A fluid heat exchanger assembly cools an electronic device with a cooling fluid supplied from a heat extractor (R, F) to a plurality of tubes extending between header tanks in an upper portion of a housing. A refrigerant is disposed in the lower portion of the housing for liquid-to-v |
| 6918431 |
Cooling assembly |
July 19, 2005 |
| A cooling assembly having a base plate and a condenser plate. An outer wall interconnects the base plate to the condenser plate to define a sealed chamber with a working fluid being disposed within the sealed chamber. Intersecting partition walls are mounted to the condenser plate and ar |
| 6880620 |
Heating, ventilating, and air conditioning module having an improved heater core configuration |
April 19, 2005 |
| The subject invention includes a heating, ventilating, and air conditioning (HVAC) assembly having a housing with an inlet and at least one outlet for directing a flow of air into a passenger compartment. An evaporator core is disposed within the housing downstream of the inlet and upstr |
| 6840311 |
Compact thermosiphon for dissipating heat generated by electronic components |
January 11, 2005 |
| A compact thermosiphon assembly for dissipating heat generated by electronic components using a working fluid includes a tube having a first end and a second end and a flat cross section defining an elongated chamber is disclosed. The tube has an evaporation region for receiving heat |
| 6840307 |
High performance heat exchange assembly |
January 11, 2005 |
| Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate, at least two fins and at least one porous reticulated foam block that fills the space between the fins. |
| 6834713 |
Thermosiphon for electronics cooling with nonuniform airflow |
December 28, 2004 |
| A heat sink assembly for cooling an electronic device comprises a fan housed in a shroud, the fan including a hub and fan blades extending therefrom for causing an axially directed airflow through the shroud upon rotation of the fan blades. A thermosiphon comprises an evaporator defi |
| 6826948 |
Leak detection apparatus for a liquid circulation cooling system |
December 7, 2004 |
| A leak detection apparatus includes one or more detection devices that envelope the various pipe joints of a liquid circulation cooling system. In one approach, the detection devices include a pair of conductors separated by a wicking material impregnated with a crystalline salt that |
| 6796135 |
Method and apparatus for odor-free operation of an air conditioning system |
September 28, 2004 |
| The presence of sufficient condensate flow for odor-free operation of an air conditioning system is detected based on the surface temperature of a thermistor disposed in a condensate drainpipe of the evaporator and the power supplied to the thermistor. The surface temperature is used to |
| 6761211 |
High-performance heat sink for electronics cooling |
July 13, 2004 |
| Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate having a recessed area on one surface and a flat area on another surface, at least two fins and porous reticulated foam blocks having intervening ga |
| 6714413 |
Compact thermosiphon with enhanced condenser for electronics cooling |
March 30, 2004 |
| A heat sink assembly for cooling an electronic device comprises a fan housed in a shroud, the fan including a hub and fan blades extending therefrom for causing an axially directed airflow through the shroud upon rotation of the fan blades. A thermosiphon comprises an evaporator defi |
| 6695039 |
Orientation insensitive thermosiphon assembly for cooling electronic components |
February 24, 2004 |
| A thermosiphon assembly for dissipating heat generated by an electronic component using a working fluid is disclosed. The assembly includes an evaporator having a front face, a rear face, and a peripheral wall extending between the front face and the rear face and being arcuate. A he |
| 6655159 |
Accumulator dehydrator assembly |
December 2, 2003 |
| An accumulator dehydrator assembly for use in a refrigeration cycle of an air conditioning system having an inner housing for separating the liquid component from the vapor component of the refrigerant and an integral outer shell being cup shaped and having a bottom and side walls extend |
| 6615911 |
High performance liquid-cooled heat sink with twisted tape inserts for electronics cooling |
September 9, 2003 |
| A liquid-cooled heat sink for use in combination with a heat exchanger to cool electronic or electrical devices attached to said heat sink comprises a metal block having a plurality of circular passageways therethrough defined by cylindrical walls. An inlet is in fluid communication with |
| 6615910 |
Advanced air cooled heat sink |
September 9, 2003 |
| A heat sink for cooling electrical or electronic devices comprises a base plate having a top surface and having a bottom surface for attaching to the electronic device. A folded fin formed from a strip of heat conducting material includes alternating planar portions and curved portions h |
| 6591897 |
High performance pin fin heat sink for electronics cooling |
July 15, 2003 |
| A heat sink for electronic devices comprises a spreader plate having a top surface and having a bottom surface wherein a portion thereof is defined for affixing an electronic device to be cooled thereto. A plurality of columnar pins are spaced apart one from the other in a non-uniform ma |
