| Patent Number |
Title Of Patent |
Date Issued |
| 7462936 |
Formation of circuitry with modification of feature height |
December 9, 2008 |
| A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts. |
| 7453157 |
Microelectronic packages and methods therefor |
November 18, 2008 |
| A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of th |
| 7427423 |
Components with conductive solder mask layers |
September 23, 2008 |
| A method of fabricating solder assemblies for forming solder connections that include a dielectric base having a non solder-wettable surface, a plurality of solder-wettable pads exposed to said surface, and an electrically conductive potential plane element having a non solder-wettab |
| 7361979 |
Multi-sheet conductive substrates for microelectronic devices and methods for forming such subst |
April 22, 2008 |
| A substrate is provided having a plurality of sheets. Each sheet has a first major surface containing a plurality of electrically conductive regions and a second major surface that opposes the first major surface. The sheets are arranged such that the first major surface of a sheet f |
| 7351641 |
Structure and method of forming capped chips |
April 1, 2008 |
| As disclosed herein, structures and methods are provided for forming capped chips. As provided by the disclosed method, a metal base pattern is formed on a chip insulated from wiring of the chip, and a cap is formed including a metal. The cap is joined to the metal base pattern on th |
| 7332068 |
Selective removal of dielectric materials and plating process using same |
February 19, 2008 |
| A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, thereby forming gaps |
| 7309447 |
Method for making a microelectronic package using pre-patterned, reusable mold and method for ma |
December 18, 2007 |
| A method for making a reusable mold for forming a microelectronic element package. The method including the steps of removing material from portions of a base to form recesses in the base and then depositing a mask material on at least some portions of the base. |
| 7288433 |
Method of making assemblies having stacked semiconductor chips |
October 30, 2007 |
| A stacked microelectronic assembly comprises a flexible sheet having an obverse surface and a reverse surface and including at least a first panel and a second panel. The second panel and the first panel are adjacent to each other, the second panel including terminals on the reverse |
| 7268426 |
High-frequency chip packages |
September 11, 2007 |
| A packaged semiconductor chip includes features such as a chip carrier having a large thermal conductor which can be solder-bonded to a circuit panel so as to provide enhanced thermal conductivity to the circuit panel and electromagnetic shielding and a conductive enclosure which partial |
| 7268304 |
Microelectronic connection components having bondable wires |
September 11, 2007 |
| A connection component for a semiconductor chip includes a substrate having a gap over which extends a plurality of parallel spaced apart leads. The ends of the leads are adhered to the substrate either by being bonded to contacts or being embedded in the substrate. The connection co |
| 7262368 |
Connection structures for microelectronic devices and methods for forming such structures |
August 28, 2007 |
| Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post ex |
| 7205659 |
Assemblies for temporarily connecting microelectronic elements for testing and methods therefor |
April 17, 2007 |
| A microelectronic assembly includes a first microelectronic element having a contact bearing face and at least one contact accessible at the contact bearing face, and a second microelectronic element opposing the first microelectronic element, the second microelectronic element having a |
| 7176506 |
High frequency chip packages with connecting elements |
February 13, 2007 |
| A radio frequency chip package is formed by assembling a connecting element such as a circuit board or flexible circuit tape having chips thereon with a bottom plane element such as a lead frame incorporating a large thermally-conductive plate and leads projecting upwardly from the p |
| 7176043 |
Microelectronic packages and methods therefor |
February 13, 2007 |
| A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and p |
| 7098074 |
Microelectronic assemblies having low profile connections |
August 29, 2006 |
| A method is disclosed for making a microelectronic package. A material is applied to a first major surface of a microelectronic element to reduce the heights of protrusions projecting from the first major surface. The microelectronic element is assembled to a microelectronic component. A |
| 7012323 |
Microelectronic assemblies incorporating inductors |
March 14, 2006 |
| Inductors are provided in chip assemblies such as in packaged semiconductor chips. The inductors may be incorporated in a chip carrier which forms part of the package, and may include, for example, spiral or serpentine inductors formed from traces on the chip carrier. The chip carrie |
| 6972473 |
Structure and method of making an enhanced surface area capacitor |
December 6, 2005 |
| As disclosed herein, a capacitor structure and method are provided to enhance plate surface area to provide increased capacitance. The capacitor structure includes a base which includes a surface having an m.times.n array of upwardly or downwardly extending features, or a combination of |
| 6959489 |
Methods of making microelectronic packages |
November 1, 2005 |
| A method of making a microelectronic package includes providing a substrate having a plurality of conductive leads at a first surface of the substrate. The conductive leads may have first ends permanently attached to the substrate and second ends remote from the terminal ends, the second |
| 6940158 |
Assemblies having stacked semiconductor chips and methods of making same |
September 6, 2005 |
| A stacked microelectronic assembly comprises a flexible sheet having an obverse surface and a reverse surface and including at least a first panel and a second panel. The second panel and the first panel are adjacent to each other, the second panel including terminals on the reverse surf |
| 6873039 |
Methods of making microelectronic packages including electrically and/or thermally conductive el |
March 29, 2005 |
| A method of manufacturing a plurality of microelectronic packages including electrically and/or thermally conductive elements. The method includes providing a support structure having a plurality of protrusions and depressions extending outwardly from the support. A conductive element is |
| 6867065 |
Method of making a microelectronic assembly |
March 15, 2005 |
| A method of making a microelectronic assembly includes providing a dielectric layer including a first major face having a first adhesive, a second major face having a second adhesive, and a protective liner over the second adhesive, juxtaposing a plurality of microelectronic elements |
| 6848173 |
Microelectric packages having deformed bonded leads and methods therefor |
February 1, 2005 |
| A method of making a microelectronic assembly includes juxtaposing a first element, such as a dielectric sheet having conductive leads thereon with a second element, such as a semiconductor chip, having contact thereon, and wire bonding the conductive leads on the first element to the co |
| 6794202 |
Assemblies for temporarily connecting microelectronic elements for testing and methods therefor |
September 21, 2004 |
| A method of making a microelectronic assembly includes providing a first microelectronic element having one or more conductive bumps, the conductive bumps including a first fusible material that transforms from a solid to a liquid at a first melting temperature, and providing a second |
| 6758984 |
Selective removal of dielectric materials and plating process using same |
July 6, 2004 |
| A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, thereby forming gaps alon |
| 6737265 |
Microelectronic unit forming methods and materials |
May 18, 2004 |
| Releasable leads having an elongated fixed portion extend over a surface defined by a dielectric material of a component or by a semiconductor body. A semiconductor element having a conductive structure connected to a set of contacts is also disclosed. A method of making the conductive |
| 6651321 |
Microelectronic joining processes |
November 25, 2003 |
| A Microelectronic Bonding processes wherein a microelectronic element is connected with a connection component having a polymeric body, and a bonding material is provided between contacts on the microelectronic element and conductive features of the connection component. The microele |
| 6543131 |
Microelectronic joining processes with temporary securement |
April 8, 2003 |
| A method of making microelectronic assemblies includes temporarily securing one or more microelectronic elements in place on one or more components using one or more temporary securements extending between the microelectronic elements and components and adhering to the elements and c |
| 6541845 |
Components with releasable leads and methods of making releasable leads |
April 1, 2003 |
| A connection component for a microelectronic device such as a semiconductor chip incorporates a support layer and conductive structures extending across a surface of the support layer. The conductive structures have anchors connecting them to the support layer, and releasable or unanchor |
| 6461892 |
Methods of making a connection component using a removable layer |
October 8, 2002 |
| A method of making a connection component includes providing a removable layer having first and second surfaces and forming vias at spaced apart first locations of the removable layer. A conductive material, such as copper, is deposited over the first surface of the removable layer and i |
| 6384475 |
Lead formation using grids |
May 7, 2002 |
| A component for making microelectronic units includes a grid of interspersed leads with ends of the various leads being connected to one another by frangible elements. One end of each lead is bonded to a top element and the other end of each lead is bonded to a bottom element. The to |
| 6361959 |
Microelectronic unit forming methods and materials |
March 26, 2002 |
| Electrically conductive elements such as terminals and leads are held on a support structure by a degradable connecting layer such as a adhesive degradable by heat or radiant energy. After connecting these elements to a microelectronic element such as a chip or wafer, the conductive elem |
| 6334942 |
Selective removal of dielectric materials and plating process using same |
January 1, 2002 |
| A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, thereby forming gaps alon |
| 6329605 |
Components with conductive solder mask layers |
December 11, 2001 |
| A component for forming solder connections includes a diectric base having a non solder-wettable surface, a plurality of solder-wettable pads exposed to said surface, and an electrically conductive potential plane element having a non solder-wettable surface overlying the surface of the |
| 6261863 |
Components with releasable leads and methods of making releasable leads |
July 17, 2001 |
| A connection component for a microelectronic device such as a semiconductor chip incorporates a support layer and conductive structures extending across a surface of the support layer. The conductive structures have anchors connecting them to the support layer, and releasable or unanchor |
| 6214640 |
Method of manufacturing a plurality of semiconductor packages |
April 10, 2001 |
| A method of manufacturing a plurality of semiconductor chips packages and the resulting chip package assemblies. The method includes providing a circuitized substrate having terminals and leads. A spacer layer is deposited or attached to the substrate and each chip is then attached to |
| 6063648 |
Lead formation usings grids |
May 16, 2000 |
| A component for making microelectronic units includes a grid of interspersed leads with ends of the various leads being connected to one another by frangible elements. One end of each lead is bonded to a top element and the other end of each lead is bonded to a bottom element. The to |
