| Patent Number |
Title Of Patent |
Date Issued |
| 6144106 |
Electronic coatings |
November 7, 2000 |
| The instant invention pertains to a multi-layer tamper proof electronic coating wherein the first layer is a protecting layer produced from a preceramic silicon containing material and at least one filler. The second layer is a resin sealer coat produced from a sealer resin selected from |
| 5904791 |
Use of preceramic polymers as electronic adhesives |
May 18, 1999 |
| A method of adhering an electronic component to substrate in which a layer of a preceramic polymer is applied between the electronic component and the substrate to which it is to be adhered followed by heating to convert the preceramic polymer into a ceramic. The method forms a strong bo |
| 5807611 |
Electronic coatings |
September 15, 1998 |
| The present invention relates to a ceramic coating composition comprising a preceramic material such as silicon oxide precursors, silicon carbonitride precursors, silicon carbide precursors, and silicon nitride precursors and a flux material such as B.sub.2 O.sub.3, PbO.sub.2, P.sub.2 O. |
| 5711987 |
Electronic coatings |
January 27, 1998 |
| The instant invention pertains to a multi-layer tamper proof electronic coating wherein the first layer is a protecting layer produced from preceramic silicon containing material and at least one filler. The second layer is a resin sealer coat produced from a sealer resin selected from |
| 5611884 |
Flip chip silicone pressure sensitive conductive adhesive |
March 18, 1997 |
| A method and composition for joining flip chips back-side-up with respect to substrates by applying an adhesive between the active side of the flip chip and the substrate. The adhesive is a conductive silicone pressure sensitive adhesive containing (i) a silicone resin, (ii) a siloxane g |
| 5399441 |
Method of applying opaque coatings |
March 21, 1995 |
| Disclosed is a method of forming opaque coatings on integrated circuits. The method comprises selectively applying a coating of a silica precursor resin and a filler onto the integrated circuit and heating the coated circuit at a temperature sufficient to convert the silica precursor res |
