Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Baude; Paul F.
Address:
Maplewood, MN
No. of patents:
28
Patents:












Patent Number Title Of Patent Date Issued
7645478 Methods of making displays January 12, 2010
Methods of forming displays are described. The displays have zinc oxide row and column drivers integrated onto the same display substrate as zinc oxide pixel transistors and organic light emitting diodes. The organic light emitting diodes are prepared, at least in part, using a thermal
7615501 Method for making a thin film layer November 10, 2009
A method of making a patterned layer comprises directing a beam of vaporized material toward a reflector such that the beam of vaporized material impinges an impingement surface of the reflector and is redirected from the reflector through one or more apertures in a shadow mask and o
7352213 Ac powered logic circuitry April 1, 2008
The use of an alternating current (ac) source to power logic circuitry can support satisfactory device performance for a variety of applications, while enhancing long-term stability of the circuitry. For example, when organic thin film transistor (OTFT)-based logic circuitry is powered b
7298084 Methods and displays utilizing integrated zinc oxide row and column drivers in conjunction with November 20, 2007
Methods and displays utilize row and column drivers with ZnO channels that control pixel transistors with ZnO channels, which in turn address OLEDs of an array to produce images of a display screen. A display backplane including the ZnO row and column drivers and the OLEDs may be constru
7297361 In-line deposition processes for circuit fabrication November 20, 2007
A method for circuit fabrication includes positioning first and second webs of film in proximity to each other, wherein the second web of film defines a deposition mask, and deposition material on the first web of film through the deposition mask pattern defined by the second web of the
7245151 Logic circuitry powered by partially rectified AC waveform July 17, 2007
Logic circuitry is powered by a partially rectified alternating current (ac) waveform. The waveform is partially rectified in the sense that it does not provide a clean, primarily dc power signal. Instead, it is possible to power logic circuitry with a waveform that includes a substa
7241688 Aperture masks for circuit fabrication July 10, 2007
Aperture masks and deposition techniques for using aperture masks are described. In addition, techniques for creating aperture masks and other techniques for using the aperture masks are described. The various techniques can be particularly useful in creating circuit elements for ele
7193291 Organic Schottky diode March 20, 2007
An organic Schottky diode includes a polycrystalline organic semiconductor layer with a rectifying contact on one side of the layer. An amorphous doped semiconductor layer is placed on the other side of the polycrystalline organic semiconductor layer, and it acts as a buffer between
7088145 AC powered logic circuitry August 8, 2006
The use of an alternating current (ac) source to power logic circuitry can support satisfactory device performance for a variety of applications, while enhancing long-term stability of the circuitry. For example, when organic thin film transistor (OTFT)-based logic circuitry is powered b
7078937 Logic circuitry powered by partially rectified ac waveform July 18, 2006
Logic circuitry is powered by a partially rectified alternating current (ac) waveform. The waveform is partially rectified in the sense that it does not provide a clean, primarily dc power signal. Instead, it is possible to power logic circuitry with a waveform that includes a substa
6936131 Encapsulation of organic electronic devices using adsorbent loaded adhesives August 30, 2005
Disclosed herein are organic electronic devices that are encapsulated at least in part by adsorbent-loaded transfer adhesives. The adsorbent material may be a dessicant and/or a getterer. The adsorbent-loaded transfer adhesive may form a gasket around the periphery of the device, or
6897164 Aperture masks for circuit fabrication May 24, 2005
Aperture masks and deposition techniques for using aperture masks are described. In addition, techniques for creating aperture masks and other techniques for using the aperture masks are described. The various techniques can be particularly useful in creating circuit elements for ele
6855636 Electrode fabrication methods for organic electroluminscent devices February 15, 2005
The present invention provides a process for selectively thermally transferring insulators onto organic electroluminescent stacks or layers to electronically isolate adjacent devices upon deposition of electrode material. This can allow the formation of top electrodes for a plurality
6821348 In-line deposition processes for circuit fabrication November 23, 2004
In one embodiment, the invention is directed to aperture mask deposition techniques using aperture mask patterns formed in one or more elongated webs of flexible film. The techniques involve sequentially depositing material through mask patterns formed in the film to define layers, or
6667215 Method of making transistors December 23, 2003
A method for making transistors comprises depositing source electrode and drain electrode features onto a substrate through a single aperture in a stationary shadow mask, said aperture having at least two opposing edges; wherein the shapes of the features are defined by the aperture and
6586153 Multilayer devices formed by multilayer thermal transfer July 1, 2003
A thermal transfer element for forming a multilayer device may include a substrate and a multicomponent transfer unit that, when transferred to a receptor, is configured and arranged to form a first operational layer and a second operational layer of a multilayer device. In at least some
6582876 Thermal transfer element and process for forming organic electroluminescent devices June 24, 2003
Disclosed are thermal transfer elements and processes for patterning solvent-coated layers and solvent-susceptible layers onto the same receptor substrate. These donor elements and methods are particularly suited for making organic electroluminescent devices and displays. The donor e
6410201 Thermal transfer element and process for forming organic electroluminescent devices June 25, 2002
Disclosed are thermal transfer elements and processes for patterning solvent-coated layers and solvent-susceptible layers onto the same receptor substrate. These donor elements and methods are particularly suited for making organic electroluminescent devices and displays. The donor e
6291126 Thermal transfer element and process for forming organic electroluminescent devices September 18, 2001
Disclosed are thermal transfer elements and processes for patterning organic materials for electronic devices onto patterned substrates. These donor elements and methods are particularly suited for making organic electroluminescent devices and displays. The donor elements can include a
6291116 Thermal transfer element and process for forming organic electroluminescent devices September 18, 2001
Disclosed are thermal transfer elements and processes for patterning solvent-coated layers and solvent-susceptible layers onto the same receptor substrate. These donor elements and methods are particularly suited for making organic electroluminescent devices and displays. The donor e
6270944 Thermal transfer element for forming multilayers devices August 7, 2001
A thermal transfer element for forming a multilayer device may include a substrate and a multicomponent transfer unit that, when transferred to a receptor, is configured and arranged to form a first operational layer and a second operational layer of a multilayer device. In at least some
6221553 Thermal transfer element for forming multilayer devices April 24, 2001
A thermal transfer element for forming a multilayer device may include a substrate and a multicomponent transfer unit that, when transferred to a receptor, is configured and arranged to form a first operational layer and a second operational layer of a multilayer device. In at least some
6214520 Thermal transfer element for forming multilayer devices April 10, 2001
A thermal transfer element for forming a multilayer device may include a substrate and a multicomponent transfer unit that, when transferred to a receptor, is configured and arranged to form a first operational layer and a second operational layer of a multilayer device. In at least some
6194119 Thermal transfer element and process for forming organic electroluminescent devices February 27, 2001
Disclosed are thermal transfer elements and processes for patterning solvent-coated layers and solvent-susceptible layers onto the same receptor substrate. These donor elements and methods are particularly suited for making organic electroluminescent devices and displays. The donor e
6140009 Thermal transfer element for forming multilayer devices October 31, 2000
A thermal transfer element for forming a multilayer device may include a substrate and a multicomponent transfer unit that, when transferred to a receptor, is configured and arranged to form a first operational layer and a second operational layer of a multilayer device. In at least some
6114088 Thermal transfer element for forming multilayer devices September 5, 2000
A thermal transfer element for forming a multilayer device may include a substrate and a multicomponent transfer unit that, when transferred to a receptor, is configured and arranged to form a first operational layer and a second operational layer of a multilayer device. In at least some
6058123 Selective etch for II-VI semiconductors May 2, 2000
A II-VI semiconductor device is fabricated using a selective etchant in the form of aqueous solution of HX where X is Cl or Br. The II-VI semiconductor device is composed of a number of layers. Selective etching can be enabled by introducing Mg into one of the semiconductor layers. The
5963573 Light absorbing layer for II-VI semiconductor light emitting devices October 5, 1999
A II-VI semiconductor light emitting device includes a II-VI semiconductor light emitting region and a II-VI semiconductor waveguide layer. A light absorbing layer is provided near the II-VI semiconductor waveguide layer, outside of the active region. The light absorbing layer absorbs ex










 
 
  Recently Added Patents
Single well reservoir characterization apparatus and methods
Cup
Semiconductor pressure sensor
Doherty amplifier circuit
Method and a channel estimating arrangement for performing channel estimation
Image forming apparatus forming images in response to image formation request from operation unit or external device
Magnetic storage apparatus
  Randomly Featured Patents
Combined cosmetic applicator and cap
Hammer mill provided with a device for locking the hammers in a retracted position in the drum
Information providing apparatus
Production of a film-like or fibrous structure of an aromatic polyester
Systems and methods for performing peritoneal dialysis
Bottle Stopper with seal
Prophylactic protector for echographic probes
Truck bed mounted spreader
Turbo-charged engine
Ink blade adjusting system with zero point memory