| |
 |
|
|
Inventor: Bar; Daniel
Address: Riehen, CH
No. of patents: 4
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 6579566 |
One-component epoxy resin system for trickle impregnation and hot dip rolling |
June 17, 2003 |
| The present invention relates to a process for preparing resin impregnated wire windings by trickling an impregnating resin onto a heated rotating winding or by dipping the heated rotating winding in a bath filled with an impregnating resin. The impregnating resin comprises an epoxy resi |
| 5652322 |
Heat-curable epoxy resin systems having a good reactivity/stability ratio |
July 29, 1997 |
| Heat-curable epoxy resin systems comprising(a) at least one epoxy resin,(b) at least one polycarboxylic acid anhydride, and(c) 1,4-diazabicyclo(2,2,2)octane or a C.sub.1 -C.sub.4 alkyl-substituted derivative of 1,4-diazabicyclo(2,2,2)octane as curing accelerator, andwherein one portion of the cu |
| 5597886 |
Heat-curable epoxy resin systems having a good reactivity/stability ratio |
January 28, 1997 |
| Heat-curable epoxy resin systems comprising(a) at least one epoxy resin,(b) at least one polycarboxylic acid anhydride, and(c) 1,4-diazabicyclo(2,2,2)octane or a C.sub.1 -C.sub.4 alkyl-substituted derivative of 1,4-diazabicyclo(2,2,2)octane as curing accelerator, and wherein one portion of t |
| 5274054 |
Adducts of exposides and amines |
December 28, 1993 |
| Adducts which are obtainable by reacting cycloaliphatic or heterocycloaliphatic polyamines containing at least two primary groups with polyfunctional epoxides containing more than two epoxy groups per molecule in such amounts as to supply 10-100 equivalents of active hydrogen atoms b |
|
|
|
