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Inventor: Bandoh; Kazuo
Address: Fushimi-ku, Kyoto-shi, JP
No. of patents: 3
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 4511317 |
Apparatus for enclosing semiconductors with resin by molding |
April 16, 1985 |
| Apparatus for enclosing semiconductors with resin by molding, including a stationary upper mold having a plurality of pots, and a movable lower mold opposed thereto.The upper and lower molds have cavities to which a resin material supplied to the pots is pressingly injected directly or o |
| 4388265 |
Process and apparatus for molding plastics |
June 14, 1983 |
| In molding a number of articles of plastics at the same time with use of an upper mold and a lower mold having a multiplicity of cavities in the fitting surfaces thereof, a process for molding plastics by supplying the molding material to a plurality of pots each provided for one pair of |
| 4347211 |
Process and apparatus for molding plastics |
August 31, 1982 |
| Molding apparatus including an upper and lower mold half and having a plurality of mold cavities is improved by eliminating runners and gates. An open bore adjacent each mold cavity serves as a separate pot for each cavity. A plunger moveable in each bore is used to inject plastics m |
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