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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Banba; Toshio
Address:
Tokyo, JP
No. of patents:
8
Patents:












Patent Number Title Of Patent Date Issued
8198006 Process for producing semiconductor device June 12, 2012
A process for producing a semiconductor device includes a circuit formation step of forming circuit wiring on a semiconductor wafer using a chemically-amplified resist, and a cured film formation step of forming a cured film that protects the circuit wiring after forming the circuit
8080350 Positive photosensitive resin composition, and semiconductor device and display therewith December 20, 2011
Disclosed is a positive photosensitive resin composition containing (A) an alkali-soluble resin, (B) a diazoquinone compound, (d1) an activated silicon compound and (d2) an aluminum complex. Also disclosed is a positive photosensitive resin composition containing (A) an alkali-solubl
7368205 Polyamide resin, positive-working photosensitive resin composition, method for producing pattern May 6, 2008
The invention provides a polyamide resin having a structure represented by the formula (1), wherein about 0.1 mol % to about 30 mol % of the total amount of Y in the formula (1) has a structure represented by the formula (2), further a positive-working photosensitive resin composition
7361445 Positive-working photosensitive resin composition, method for producing pattern-formed resin fil April 22, 2008
A positive-working photosensitive resin composition containing an alkali soluble resin (A), a diazoquinone compound (B) and a compound (C) which contains a --CH.sub.2OH group but not a phenolic hydroxyl group, a method for producing a pattern-formed resin film using the composition, a
7238455 Positive-working photosensitive resin composition, method for producing pattern-formed resin fil July 3, 2007
The invention provides a positive-working photosensitive resin composition comprising an alkali soluble resin (A), a diazoquinone compound (B) and a compound (C) which contains a --CH.sub.2OH group but not a phenolic hydroxyl group, a method for producing a pattern-formed resin film usin
6927013 Positive photosensitive resin compositions and semiconductor device August 9, 2005
The present invention provides a positive-working photosensitive resin composition with high sensitivity that gives a pattern having a high resolution and a high film thickness retention rate. In other words, the present invention provides a positive-working photosensitive resin comp
6607865 Positive photosensitive resin composition August 19, 2003
The present invention provides a positive photosensitive resin composition which can form a pattern of high resolution and high residual film ratio and has high sensitivity. That is, the present invention provides a positive photosensitive resin composition comprising 100 parts by weight
6576381 Semiconductor device June 10, 2003
The present invention alleviates the operational problems in production of flip chips and provides a semiconductor device superior in various reliabilities. The preset invention lies in an encapsulated semiconductor device comprising: (a) a polybenzoxazole resin film for chip protecti










 
 
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