| Patent Number |
Title Of Patent |
Date Issued |
| 8198006 |
Process for producing semiconductor device |
June 12, 2012 |
| A process for producing a semiconductor device includes a circuit formation step of forming circuit wiring on a semiconductor wafer using a chemically-amplified resist, and a cured film formation step of forming a cured film that protects the circuit wiring after forming the circuit |
| 8080350 |
Positive photosensitive resin composition, and semiconductor device and display therewith |
December 20, 2011 |
| Disclosed is a positive photosensitive resin composition containing (A) an alkali-soluble resin, (B) a diazoquinone compound, (d1) an activated silicon compound and (d2) an aluminum complex. Also disclosed is a positive photosensitive resin composition containing (A) an alkali-solubl |
| 7368205 |
Polyamide resin, positive-working photosensitive resin composition, method for producing pattern |
May 6, 2008 |
| The invention provides a polyamide resin having a structure represented by the formula (1), wherein about 0.1 mol % to about 30 mol % of the total amount of Y in the formula (1) has a structure represented by the formula (2), further a positive-working photosensitive resin composition |
| 7361445 |
Positive-working photosensitive resin composition, method for producing pattern-formed resin fil |
April 22, 2008 |
| A positive-working photosensitive resin composition containing an alkali soluble resin (A), a diazoquinone compound (B) and a compound (C) which contains a --CH.sub.2OH group but not a phenolic hydroxyl group, a method for producing a pattern-formed resin film using the composition, a |
| 7238455 |
Positive-working photosensitive resin composition, method for producing pattern-formed resin fil |
July 3, 2007 |
| The invention provides a positive-working photosensitive resin composition comprising an alkali soluble resin (A), a diazoquinone compound (B) and a compound (C) which contains a --CH.sub.2OH group but not a phenolic hydroxyl group, a method for producing a pattern-formed resin film usin |
| 6927013 |
Positive photosensitive resin compositions and semiconductor device |
August 9, 2005 |
| The present invention provides a positive-working photosensitive resin composition with high sensitivity that gives a pattern having a high resolution and a high film thickness retention rate. In other words, the present invention provides a positive-working photosensitive resin comp |
| 6607865 |
Positive photosensitive resin composition |
August 19, 2003 |
| The present invention provides a positive photosensitive resin composition which can form a pattern of high resolution and high residual film ratio and has high sensitivity. That is, the present invention provides a positive photosensitive resin composition comprising 100 parts by weight |
| 6576381 |
Semiconductor device |
June 10, 2003 |
| The present invention alleviates the operational problems in production of flip chips and provides a semiconductor device superior in various reliabilities. The preset invention lies in an encapsulated semiconductor device comprising: (a) a polybenzoxazole resin film for chip protecti |
