| Patent Number |
Title Of Patent |
Date Issued |
| RE40061 |
Multi-chip stacked devices |
February 12, 2008 |
| A multiple stacked die device is disclosed that contains up to four dies and does not exceed the height of current single die packages. Close-tolerance stacking is made possible by a low-loop-profile wire-bonding operation and thin-adhesive layer between the stacked dies. |
| RE36613 |
Multi-chip stacked devices |
March 14, 2000 |
| A multiple stacked die device is disclosed that contains up to four dies and does not exceed the height of current single die packages. Close-tolerance stacking is made possible by a low-loop-profile wire-bonding operation and thin-adhesive layer between the stacked dies. |
| 7371612 |
Method of fabrication of stacked semiconductor devices |
May 13, 2008 |
| A method for increasing integrated circuit density is disclosed comprising stacking an upper wafer and a lower wafer, each of which having fabricated circuitry in specific areas on their respective face surfaces. The upper wafer is attached back-to-back with the lower wafer with a la |
| 7275676 |
Apparatus for locating conductive spheres utilizing screen and hopper of solder balls |
October 2, 2007 |
| Apparatus for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-h |
| 7166495 |
Method of fabricating a multi-die semiconductor package assembly |
January 23, 2007 |
| An apparatus and method for increasing integrated circuit density comprising an upper die and a lower die, the latter preferably a flip chip, which are connected to a conductor-carrying substrate or a leadframe. The upper die is attached back-to-back to the lower die with a layer of |
| 7131568 |
Methods for lead penetrating clamping system |
November 7, 2006 |
| An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method include the use of a penetrating individual independent lead finger clamp during the wire bonding process |
| 7105432 |
Method of locating conductive spheres utilizing screen and hopper of solder balls |
September 12, 2006 |
| Methods for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-hol |
| 6989285 |
Method of fabrication of stacked semiconductor devices |
January 24, 2006 |
| A method for increasing integrated circuit density is disclosed comprising stacking an upper wafer and a lower wafer, each of which having fabricated circuitry in specific areas on their respective face surfaces. The upper wafer is attached back-to-back with the lower wafer with a la |
| 6981629 |
Apparatus of clamping semiconductor devices using sliding finger supports |
January 3, 2006 |
| An apparatus for supporting lead fingers during a wire bonding process and method of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of |
| 6957760 |
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder |
October 25, 2005 |
| A method of attaching solder balls to a BGA package using a ball pickup tool is disclosed. An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. The ball pickup tool picks up balls with a vacuum suction from a fluidized ba |
| 6956294 |
Apparatus for routing die interconnections using intermediate connection elements secured to the |
October 18, 2005 |
| A semiconductor device, such as an integrated circuit die, includes a plurality of bond pads on an active surface thereof electrically connected to internal circuitry of the semiconductor device, and a plurality of jumper pads on the active surface which are electrically isolated from |
| 6949158 |
Using backgrind wafer tape to enable wafer mounting of bumped wafers |
September 27, 2005 |
| A method and apparatus are disclosed for mounting a wafer on a mount and thinning the wafer. The wafer includes a front surface having bumps with an adhesive tape having a backing attached thereto and a back surface. The front surface of the wafer is mounted facedown on a suction surface |
| 6886734 |
Device and method for clamping and wire-bonding the leads of a lead frame one set at a time |
May 3, 2005 |
| A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds |
| 6884657 |
Angularly offset stacked die multichip device and method of manufacture |
April 26, 2005 |
| An offset die stacking arrangement is disclosed having at least one upper level die having a width which is less than the distance separating the opposing bonding sites of the underlying die. The upper die is fixed above the lower die and rotated within a plane parallel to the lower die |
| 6861345 |
Method of disposing conductive bumps onto a semiconductor device |
March 1, 2005 |
| A method of forming conductive structures on the contact pads of a substrate,such as a semiconductor die or a printed circuit board. A solder mask is secured to an active surface of the substrate. Apertures through the solder mask are aligned with contact pads on the substrate. The a |
| 6845898 |
Bondhead lead clamp apparatus |
January 25, 2005 |
| An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide inc |
| 6844216 |
Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball |
January 18, 2005 |
| A method of attaching solder balls to a BGA package using a ball pickup tool. An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. The ball pickup tool picks up balls with a vacuum suction from a fluidized ball reserv |
| 6837418 |
Bondhead lead clamp apparatus and method |
January 4, 2005 |
| A method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The method includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the |
| 6786387 |
Method for clamping and wire-bonding the leads of a lead frame one set at a time |
September 7, 2004 |
| A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds |
| 6784023 |
Method of fabrication of stacked semiconductor devices |
August 31, 2004 |
| A method for increasing integrated circuit density comprising stacking an upper wafer and a lower wafer, each of which have fabricated circuitry in specific areas on their respective face surfaces. The upper wafer is attached back-to-back with the lower wafer with a layer of adhesive |
| 6732902 |
Lead penetrating clamping system |
May 11, 2004 |
| An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method include the use of a penetrating individual independent lead finger clamp during the wire bonding process |
| 6715659 |
Apparatus for clamping semiconductor devices using sliding finger supports |
April 6, 2004 |
| An apparatus for supporting lead fingers during a wire bonding process and of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion of the lea |
| 6662993 |
Bondhead lead clamp apparatus |
December 16, 2003 |
| An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide inc |
| 6641459 |
Method for conserving a resource by flow interruption |
November 4, 2003 |
| A method of conserving a facility delivered to a machine during the machine's idle mode is herein described. In one embodiment, the method is directed to a method for conserving coolant water delivery to a semiconductor wafer grinding machine. The system monitors the status of the gr |
| 6641381 |
Wafer dicing blade consisting of multiple layers |
November 4, 2003 |
| The present invention provides a multi-layered diamond dicing blade. More particularly, the blade is a multi-layered dicing blade comprising an inner layer with a first set of diamond particles and an outer layer overlying the inner layer. The inner layer extends to the outermost per |
| 6637636 |
Apparatus of clamping semiconductor devices using sliding finger supports |
October 28, 2003 |
| An apparatus and method of supporting lead fingers during a wire bonding process and method of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under |
| 6630372 |
Method for routing die interconnections using intermediate connection elements secured to the di |
October 7, 2003 |
| A semiconductor device, such as an integrated circuit die, includes a plurality of bond pads on an active surface thereof electrically connected to internal circuitry of the semiconductor device, and a plurality of jumper pads on the active surface which are electrically isolated from |
| 6624059 |
Method of improving interconnect of semiconductor devices by utilizing a flattened ball bond |
September 23, 2003 |
| A method of forming a semiconductor device assembly comprising forming a wire bump on at least one bond pad on the active surface of a semiconductor device and connecting one end of a wire to the wire bump using a wire bond. The wire bump may be flattened before connecting one end of |
| 6621147 |
In-process device with grooved coating layer on a semiconductor wafer for relieving surface tens |
September 16, 2003 |
| A method used during the manufacture of a semiconductor device comprises providing a semiconductor wafer assembly, the assembly including a plurality of unsegmented semiconductor dice. A coating layer is formed over the semiconductor wafer assembly which causes the wafer to warp, for |
| 6607121 |
Quick change precisor |
August 19, 2003 |
| A precisor plate for an automatic wire bonder having a heat block attachment portion thereon to precisely attach a heat block thereto provides a simple and quickly adjustable precisor plate and method of alignment. The precisor plate includes fixed alignment pins to align the preciso |
| 6604671 |
Bondhead lead clamp apparatus and method |
August 12, 2003 |
| A method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The method includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the |
| 6604670 |
Lead penetrating clamping system |
August 12, 2003 |
| An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process |
| 6602778 |
Apparatus and methods for coupling conductive leads of semiconductor assemblies |
August 5, 2003 |
| A method and apparatus for electrically coupling bond pads on the surface of a microelectronic device. The apparatus can include a microelectronic device having at least two bond pads with a conductive member extending between the bond pads, external to the device. In one embodiment, the |
| 6595408 |
Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball |
July 22, 2003 |
| An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. A ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to cond |
| 6572444 |
Apparatus and methods of automated wafer-grinding using grinding surface position monitoring |
June 3, 2003 |
| Apparatus and methods of automated wafer-grinding using grinding surface position monitoring. In one embodiment, an apparatus for grinding a working surface includes a grinding surface engageable with at least a portion of the working surface, and a feed mechanism that controllably a |
| 6563205 |
Angularly offset and recessed stacked die multichip device and method of manufacture |
May 13, 2003 |
| An offset die stacking arrangement is disclosed having at least one upper level die having a width which is less than the distance separating the opposing bonding sites of the underlying die. The lowest die is affixed to the substrate within a recess in the substrate. The upper die is fi |
| 6561177 |
Wafer dicing blade consisting of multiple layers |
May 13, 2003 |
| The present invention provides a multi-layered diamond dicing blade. More particularly, the blade is a multi-layered dicing blade comprising an inner layer with a first set of diamond particles and an outer layer overlying the inner layer. The inner layer extends to the outermost per |
| 6551917 |
Method of locating conductive spheres utilizing screen and hopper of solder balls |
April 22, 2003 |
| Apparatus and methods for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the |
| 6539855 |
Method and apparatus for screen printing |
April 1, 2003 |
| A screen printing apparatus and method for forming printed wiring on a substrate, such as a wafer. The apparatus includes a reservoir disposed beneath a screen having a plurality of openings forming a pattern thereon. Disposed within the reservoir is a printing paste. The screen is press |
| 6533159 |
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder |
March 18, 2003 |
| An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. A ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to cond |
| 6494357 |
Lead penetrating clamping system |
December 17, 2002 |
| An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method include the use of a penetrating individual independent lead finger clamp during the wire bonding process |
| 6484922 |
Apparatus and method of clamping semiconductor devices using sliding finger supports |
November 26, 2002 |
| An apparatus and method of supporting lead fingers during a wire bonding process and of preventing the bonding apparatus and clamping assembly from applying force against the die. The present invention includes the use of a movable arm with a portion that is positionable under a portion |
| 6478211 |
Device and method for clamping and wire-bonding the leads of a lead frame one set at a time |
November 12, 2002 |
| A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds |
| 6467672 |
Methods for clamping and wire-bonding the leads of a lead frame one set at a time |
October 22, 2002 |
| A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds |
| 6464123 |
Bondhead lead clamp apparatus and method |
October 15, 2002 |
| An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide inc |
| 6435400 |
Bondhead lead clamp apparatus and method |
August 20, 2002 |
| An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide inc |
| 6420256 |
Method of improving interconnect of semiconductor devices by using a flattened ball bond |
July 16, 2002 |
| A method of forming a semiconductor device assembly comprising forming a wire bump on at least one bond pad on the active surface of a semiconductor device and connecting one end of a wire to the wire bump using a wire bond. The wire bump may be flattened before connecting one end of |
| 6419145 |
Lead penetrating clamping system |
July 16, 2002 |
| An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process |
| 6407456 |
Multi-chip device utilizing a flip chip and wire bond assembly |
June 18, 2002 |
| An apparatus and method for increasing integrated circuit density comprising an upper die and a lower die, the latter preferably a flip-chip, which are connected to a conductor-carrying substrate or a leadframe. The upper die is attached back-to-back to the lower die with a layer of |
| 6403449 |
Method of relieving surface tension on a semiconductor wafer |
June 11, 2002 |
| A method used during the manufacture of a semiconductor device comprises providing a semiconductor wafer assembly, the assembly including a plurality of unsegmented semiconductor dice. A coating layer is formed over the semiconductor wafer assembly which causes the wafer to warp, for |
