| Patent Number |
Title Of Patent |
Date Issued |
| 6172412 |
High frequency microelectronics package |
January 9, 2001 |
| A high frequency microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive and attached to an RF substrate with a cavity formed at its center. The base may be metal or ceramic with a metal layer deposited thereo |
| 5753972 |
Microelectronics package |
May 19, 1998 |
| A microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached to an RF substrate with a cavity formed at its center and a pattern of conductive paths for providing interconnection from the inside to the o |
| 5736783 |
High frequency microelectronics package |
April 7, 1998 |
| A high frequency microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive and attached to an RF substrate with a cavity formed at its center. The base may be metal or ceramic with a metal layer deposited thereo |
| 5692298 |
Method of making ceramic microwave electronic package |
December 2, 1997 |
| A ceramic microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached either by seal glass or by solder to a ceramic RF substrate with a cavity formed at its center and a pattern of conductive paths for p |
| 5465008 |
Ceramic microelectronics package |
November 7, 1995 |
| A ceramic microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached either by seal glass or by solder to a ceramic RF substrate with a cavity formed at its center and a pattern of conductive paths for p |
| 5448826 |
Method of making ceramic microwave electronic package |
September 12, 1995 |
| A ceramic microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached either by seal glass or by solder to a ceramic RF substrate with a cavity formed at its center and a pattern of conductive paths for p |
