Resources Contact Us Home Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE     Inventor: Arai; Noriyuki Address: Tsukuba, JP No. of patents: 1 Patents: Patent Number Title Of Patent Date Issued 5644003 Epoxy resin composition, process for producing the same and resin-sealed semiconductor device July 1, 1997 An epoxy resin composition which comprises: (a) an epoxy resin having at least two epoxy groups in the molecule, (b) an epoxy resin curing agent, (c) a cure accelerator, (d) an aromatic polyamide pulp and (e) an inorganic filler as the essential components, the aromatic polyamide pulp       Recently Added Patents Working distance and alignment sensor for a fundus camera Data sequence compression Portfolio optimization by means of meta-resampled efficient frontiers Fast decoder and method for front end of convolutionally encoded information stream Cellular phone Semiconductor device with T-shaped gate electrode and hollow region adjacent the gate electrode Flow meter   Randomly Featured Patents Method and apparatus for improving performance of a force balance accelerometer based on a single-coil velocity geophone Device and method for separating components of a fluid sample Device for uniformly regulating the density of toner supplied to a developing unit Apparatus for curing coatings applied to a member Apparatus for movement along an underground passage and method using same Conductive pyrolyzed dielectrics and articles made therefrom Direct vertical pin feeder Apparatus for the uniform distribution of a small amount of liquid on bulk materials Optical element and method for producing the same Powered air-purifying respirator attachment clip © 2006. PatentGenius. All Rights Reserved.