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Inventor:
Alpern; Peter
Address:
Munchen, DE
No. of patents:
1
Patents:












Patent Number Title Of Patent Date Issued
6653732 Electronic component having a semiconductor chip November 25, 2003
An electronic component includes a semiconductor chip and/or a test structure. The semiconductor chip includes a multi-layer coating having at least one interconnect layer, at least one insulation layer, and at least one planarization layer. A method of producing the component is also










 
 
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