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Inventor: Adel; Michael E.
Address: Zichron Yakov, IL
No. of patents: 2
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 5856871 |
Film thickness mapping using interferometric spectral imaging |
January 5, 1999 |
| A method of determining the thickness map of a film (14) overlying a substrate (14). This method includes illuminating (10) the film simultaneously from different angles and analyzing spectral intensity of the radiation reflected by each point on the film (14). The analysis is effect |
| 5823681 |
Multipoint temperature monitoring apparatus for semiconductor wafers during processing |
October 20, 1998 |
| An emissivity compensating non-contact system for measuring the temperature of a semiconductor wafer. The system includes a semiconductor wafer emissivity compensation station for measuring the reflectivity of the wafer at discrete wavelengths to yield wafer emissivity in specific wa |
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