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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Abe; Takao
Address:
Yukuhashi, JP
No. of patents:
1
Patents:




Patent Number Title Of Patent Date Issued
7393706 Method of manufacturing optical semiconductor device, package molding jig, method of manufacturi July 1, 2008
A method of manufacturing an optical semiconductor device includes preparing an optical semiconductor provided on a distal end of a first lead portion of a lead frame and connected electrically with a distal end of a second lead portion of the lead frame, forming thermoplastic resin


 
 
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