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Inventor: Abe; Ryo
Address: Hyogo, JP
No. of patents: 1
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 6727581 |
Semiconductor module |
April 27, 2004 |
| In a case that a bare chip has been detected as being defective from among bare chips, a good chip is mounted to the rear surface of the surface wherein the bare chips are provided to a semiconductor module substrate so that a QFC pin of the bare chip is fixed at the ground potential (GN |
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