| Patent Number |
Title Of Patent |
Date Issued |
| 7193320 |
Semiconductor device having a heat spreader exposed from a seal resin |
March 20, 2007 |
| A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor |
| 6796024 |
Method for making semiconductor device |
September 28, 2004 |
| According to the method of producing a semiconductor device, the substrate is provided with an opening formed at a substantially central position, interconnections and joining parts. The heat spreading plate has a fixed portion fixed to the substrate, a stage portion caved with respect t |
| 6559536 |
Semiconductor device having a heat spreading plate |
May 6, 2003 |
| A semiconductor device includes a semiconductor chip, a substrate electrically connected to the semiconductor chip and heat spreading plate thermally connected to the semiconductor chip. The substrate is provided with external connection terminals on a first surface and electrically |
| 6424032 |
Semiconductor device having a power supply ring and a ground ring |
July 23, 2002 |
| In a semiconductor device, an influence of the simultaneous switching noise is reduced by increasing the decoupling capacity between a ground ring and a power supply ring. A semiconductor element having a plurality of electrode pads is mounted on a redistribution substrate. The power sup |
| 6333564 |
Surface mount type semiconductor device and method of producing the same having an interposing l |
December 25, 2001 |
| A semiconductor device and a method of producing the same, the device including a semiconductor chip; balls which function as external connecting terminals; a substrate which electrically connects the semiconductor chip and the balls; a mold resin which seals at least a part of the s |
| 6307259 |
Plastic package for semiconductor device |
October 23, 2001 |
| According to the present invention, for a multi-layer plastic package having bonding pads at multiple levels, a plurality of electrically independent side wall conductive layers can be provided by forming side wall conductive layer on the side wall of an opening in each insulating la |
| 6288444 |
Semiconductor device and method of producing the same |
September 11, 2001 |
| A semiconductor device and a method of producing the semiconductor device are provided. This semiconductor device includes a semiconductor chip, a printed wiring board, a heat spreader, a sealing resin, and solder balls. The printed wiring board is provided with the solder balls on an ou |
