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Inventor: Abe; Mitsuhiro
Address: Hirakata, JP
No. of patents: 2
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 5556647 |
Encapsulation mold |
September 17, 1996 |
| An encapsulation mold includes a pot for heating resin inserted therein, a plunger, movably arranged in the pot, for extruding the resin from a bottom of the pot, and first and second retainer plates. One of the retainer plates includes a plurality of package portions, connected to the |
| 5349136 |
Mold tool assembly |
September 20, 1994 |
| A mold tool for forming an electronic component having a semiconductor chip sealed on a supporting member by a resin-molded package, includes an upper mold having an upper cavity and a lower mold having a lower cavity, the package being molded in the cavities. Upper and lower gates are a |
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