Resources Contact Us Home Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE     Inventor: Abe; Kimihiro Address: Fuji, JP No. of patents: 1 Patents: Patent Number Title Of Patent Date Issued 7291517 Method for removing resin mask layer and method for manufacturing solder bumped substrate November 6, 2007 Using a dry film resist that is a photosensitive resin, a resin mask layer is formed around electrodes on a substrate. A solder precipitating composition is applied on the substrate, and this solder precipitating composition is heated to precipitate solder on the surface of the elect       Recently Added Patents Monolithic integrated circuit having enhancement mode/depletion mode field effect transistors and RF/RF/microwave/milli-meter wave milli-meter wave field effect transistors Systems and methods for electrical leakage detection and compensation Insulated wall panel Method of heat treatment of stainless steel Pyridodihydropyraziones, process for their manufacture and use thereof as medicaments Computer bus power consuming device Tool cradle   Randomly Featured Patents Tumbler mug with grips System and method of monitoring, predicting and optimizing production yields in a liquid crystal display (LCD) manufacturing process Radial plunger type pump with counter weight and washer integrally secured Processes for the modification of wheat gluten Nitro- and aminobenzamide compounds for neurodegenerative disorders Camera system Coordination catalyst systems Method and apparatus for switching low voltage CMOS switches in high voltage digital to analog converters Method of manufacturing semiconductor devices having improvements in device reliability by thermally treating selectively implanted test figures in wafers System for dissipating electrostatic charges © 2006. PatentGenius. All Rights Reserved.