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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Abe; Kenshiro
Address:
Edsakimachi, JP
No. of patents:
1
Patents:




Patent Number Title Of Patent Date Issued
6415121 Connecting method of resin material molded product, process cartridge and assembling method of p July 2, 2002
A bonding method for bonding molded resin products, includes the step of bonding a first one of the molded resin products and a second one of the molded resin products by injecting resin material through a resin material injection path to a bonding portion therebetween, wherein the resin


 
 
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