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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Abe; Kenichiro
Address:
Kawasaki, JP
No. of patents:
5
Patents:












Patent Number Title Of Patent Date Issued
7935891 Wiring board manufacturing method May 3, 2011
The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably formi
7388157 Printed wiring board June 17, 2008
A printed wiring board is made of first and second substrates superimposed on each other. The first and second substrates respectively include a core layer made of resin containing carbon fibers. The second substrate has the outline different from that of the first substrate. A stepped
7377030 Wiring board manufacturing method May 27, 2008
The present invention relates to a method of manufacturing a wiring board comprising: a build-up layer, in which wiring patterns are piled with insulating layers; and a core substrate, which is separately formed from the build-up layer, the method comprising the steps of: separably formi
7152314 Method of manufacturing circuit board December 26, 2006
The method of manufacturing a circuit board is capable of preventing deformation of a core substrate, ensuring size thereof and highly concentrating cable patterns so as to realize compact and high-performance semiconductor devices. The method of manufacturing a circuit board of the
5549778 Manufacturing method for multilayer ceramic substrate August 27, 1996
A manufacturing method for a multilayer ceramic substrate superior in adhesion between the substrate and thick film pads formed on the surface of the substrate. Copper paste is screen-printed on a glass-ceramics green sheet for forming a surface layer to form a plurality of surface thick










 
 
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