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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Abe; Katsuo
Address:
Yokosuka, JP
No. of patents:
11
Patents:




Patent Number Title Of Patent Date Issued
5651867 Plasma processing method and apparatus July 29, 1997
A plasma processing apparatus comprising: a vacuum container; an evacuation means for keeping the interior of the vacuum container at a pressure not higher than atmospheric pressure; a substrate support device for supporting a substrate to be subjected to plasma processing; an electrode
4950548 Magnetic recording medium and method of producing same August 21, 1990
The present invention relates to a magnetic recording medium for a magnetic disk unit or the like and, more particularly, to a magnetic recording medium having its recording layer made of a magnetic alloy film with uniform magnetic characteristics. The present magnetic recording medium
4610774 Target for sputtering September 9, 1986
A sputtering target structure suitable for use with a planar magnetron sputtering electrode device has a plurality of annular target members arranged concentrically. The annular target member is provided with either an annular groove for concentration of an electric field or an annular
4606802 Planar magnetron sputtering with modified field configuration August 19, 1986
Planar magnetron sputtering sputters a target formed of plural target members from their principal surface. The plural target members are arranged on an electrode. The sputtering is carried out in such a condition that an electric field and magnetic field are substantially parallel i
4517444 Thermal printhead May 14, 1985
Disclosed is a thermal printhead made of an insulating substrate, and a heat generating resistor layer formed on the substrate, and wherein the heat generating resistor layer is supplied with electric current. The heat generating resistor layer is made of Cr-Si-SiO alloy, and with the Cr
4460494 Resistor July 17, 1984
Disclosed is a resistor made of an alloy consisting essentially of Cr, Si and SiO.
4444635 Film forming method April 24, 1984
A film forming method by plasma sputtering is provided to attain a composite film on a substrate. A target plate having metal materials in a different pattern is prepared in opposition to the substrate. A plasma is created by a planar magnetron sputtering electrode structure. The plasma
4430387 Base plate for magnetic recording disc February 7, 1984
A base plate for magnetic recording disc is produced by coating thin metal layers containing no impurities for forming defects by an anodizing treatment on one or both sides of a discoid substrate made of a metal such as aluminum or an aluminum alloy or from a plastic by a dry process, a
4405435 Apparatus for performing continuous treatment in vacuum September 20, 1983
An apparatus for performing continuous treatment in vacuum including an inlet chamber, a first intermediate chamber, at least one vacuum treating chamber, a second intermediate chamber and a withdrawing chamber arranged in the indicated order in a direction in which base plates are s
4401539 Sputtering cathode structure for sputtering apparatuses, method of controlling magnetic flux gen August 30, 1983
A sputtering apparatus of the planar magnetron type is disclosed, in which a low-pressure gas is ionized by glow discharge, ions in the plasma are accelerated by a voltage applied between a cathode and an anode to bombard a target structure, atoms or particles of a target material sputte
4308571 Low temperature-sinterable dielectric composition and thick film capacitor using the same December 29, 1981
A low temperature-sinterable dielectric composition is provided, whose sintered composition when prepared by firing a uniform mixture consisting of lead ferrotungstate, lead titanate and manganese dioxide at a temperature of not higher than 1,000.degree. C. has the general formula A.


 
 
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