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Inventor: Abe; Hajime
Address: Tokyo, JP
No. of patents: 2
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 7547587 |
Method for manufacturing semiconductor light emitting device |
June 16, 2009 |
| A laminated structure having light-emitting units is formed on a single-crystal wafer. Electrode patterns are formed on the single-crystal wafer opposite the light-emitting units. Dummy patterns are formed on the single-crystal wafer at a location spaced apart from a location opposite |
| 5298328 |
Packing material and method of making same |
March 29, 1994 |
| A packing material for sealing electronic devices having improved, higher thermal conductivity than amorphous silica-containing packing material. The packing material comprises a thermosetting resin and a filler particle comprising a core inorganic particle and an amorphous silica coatin |
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