Resources Contact Us Home Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE     Inventor: Abdallah; Hichem Address: Koln, DE No. of patents: 1 Patents: Patent Number Title Of Patent Date Issued 7061746 Semiconductor component with integrated capacitance structure having a plurality of metallizatio June 13, 2006 A semiconductor component includes an insulating layer, which is configured on a semiconductor substrate and in which a capacitor structure is formed. The capacitor structure has at least two parallel metallization planes, whereby at least one of the planes is configured in a lattice       Recently Added Patents Electronic device and method for managing power distribution therein Testing method for permanent electrical removal of an integrated circuit output Second stage turbine airfoil Wall-mounted faucet Fabrication of layer-by-layer photonic crystals using two polymer microtransfer molding Enhanced OBIGGS Inkjet head including plates bonded together by adhesive   Randomly Featured Patents Hydrostatic drive system Prefabricated support and floor system for building Sack closing instrument Battery charger/remote control for portable radio devices Transmission with a first-stage hydrostatic mode and two hydromechanical stages Face seal with hydrodynamic thrust pads Deionized water degasification for semiconductor fabrication Method of driving multiple chip CCD image sensor Wire raceway for attachment under the floor of a railway car Surface acoustic wave device, method of manufacturing the device, and electronic component using the device and method © 2006. PatentGenius. All Rights Reserved.