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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Inventor:
Aaron; David A.
Address:
Reisterstown, MD
No. of patents:
4
Patents:




Patent Number Title Of Patent Date Issued
6820685 Densified heat transfer tube bundle November 23, 2004
A heat exchanger coil assembly is made up of arrays of substantially equally spaced apart serpentine circuits located in the coil assembly region of the conduit, with adjacent circuits being arranged in a parallel offset fashion in which adjacent return bends are overlapping. The tubes
5386709 Subcooling and proportional control of subcooling of liquid refrigerant circuits with thermal st February 7, 1995
The present invention provides method and apparatus for incorporating thermal storage and other low-temperature reservoirs with new or retrofittable refrigerant circuit devices to increase their thermal operating capacity and efficiency by subcooling refrigerant condensate with subco
5345780 Bi-flow expansion device September 13, 1994
A bi-flow expansion device for a heat pump or other apparatus where fluid avel is reversed with different required flow rates in each direction. The device comprises a tubular member mounted in a refrigerant line and having non-symmetrical entrance-exits at the ends of the tubular member
5085058 Bi-flow expansion device February 4, 1992
A bi-flow expansion device for a heat pump or other apparatus where fluid avel is reversed with different required flow rates in each direction. The device comprises a tubular member mounted in a refrigerant line and having non-symmetrical entrance-exits at the ends of the tubular member


 
 
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